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| 型號： | pentium II cpu with mobile |
| 廠商： | Intel Corp. |
| 英文描述： | pentium II processor With On-die Cache Mobile Module Connector 2 (MMC-2)(帶緩存和連接器2的奔II處理器) |
| 中文描述： | 奔騰II處理器芯片上緩存手機模塊連接器2（絲裂霉素2）（帶緩存和連接器2的奔二處理器） |
| 文件頁數(shù)： | 44/48頁 |
| 文件大?。?/td> | 537K |
| 代理商： | PENTIUM II CPU WITH MOBILE |
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Intel
a
Pentium
a
II Processor With On-Die Cache Mobile Module MMC-2
44
Figure 15. Thermal Transfer Plate (B)
5.3
Module Physical Support
5.3.1
Module Mounting Requirements
Three mounting holes are available for securing the module
to the system base. See Figure 9 for mounting hole
locations. These hole locations and board edge clearances
will remain fixed for all Intel mobile modules. All three
mounting holes should be used to ensure long term
mechanical reliability and EMI integrity of the system. The
board edge clearance includes a 0.762-millimeter (0.030
inches) wide EMI containment ring around the perimeter of
the module. This ring is on each layer of the module PCB
and is grounded. On the surface of the module, the metal is
exposed for EMI shielding purposes. The hole patterns also
have a plated surrounding ring to use a metal standoff for
EMI shielding purposes.
Standoffs should be used to provide support for the installed
module. The distance from the bottom of the module PCB to
the top of the system electronics board with the connectors
mated is 4.0 millimeters + 0.16 millimeters / -0.13
millimeters. However, the warpage of the baseboard can
vary and should be calculated into the final dimensions of
the standoffs used. All calculations can be made with the
Intel
a
MMC-2 Standoff/Receptacle Height Spreadsheet.
Information on this spreadsheet can be obtained from your
local Intel representative.
Figure 16 shows the standoff support hole patterns, the
board edge clearance, and the dimensions of the EMI
containment ring. No components are placed on the board in
the keep-out area.
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