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參數(shù)資料
| 型號： | PDIUSBD11 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | USB device with serial interface |
| 中文描述： | USB設(shè)備的串行接口 |
| 文件頁數(shù)： | 18/20頁 |
| 文件大?。?/td> | 119K |
| 代理商： | PDIUSBD11 |
Philips Semiconductors
Product specification
PDIUSBD11
USB device with serial interface
1999 Jul 22
18
SUITABILITY OF IC PACKAGES FOR WAVE, REFLOW AND DIPPING SOLDERING METHODS
Mo nting
Mounting
Package
Soldering Method
Wave
Reflow
1
Dipping
Through-hole mount
DBS, DIP, HDIP, SDIP, SIL
suitable
2
–
suitable
BGA, SQFP,
not suitable
suitable
–
HLQFP, HSQFP, HSOP, SMS
not suitable
3
suitable
–
Surface mount
PLCC, SO, SOJ
suitable
suitable
–
LQFP, QFP, TQFP
not recommended
4, 5
suitable
–
SSOP, TSSOP, VSO
not recommended
6
suitable
–
NOTES:
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to
time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in
them (the so-called “popcorn” effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages;
Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version)
cannot be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction. The package footprint must
incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP, and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pith (e) equal to or larger than 0.65 mm; it is definitely not suitable for
packages with a pitch (e) equal to or smaller than 0.5 mm.
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PDF描述 |
|---|---|
| PDIUSBD11N | USB device with serial interface |
| PDIUSBD12 | nullUSB interface device with parallel bus |
| PDUSBD12PWDH | nullUSB interface device with parallel bus |
| PDIUSBD12D | nullUSB interface device with parallel bus |
| PDIUSBD12PW | nullUSB interface device with parallel bus |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PDIUSBD11D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:USB device with serial interface |
| PDIUSBD11D-T | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:BUS CONTROLLER |
| PDIUSBD11N | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:USB device with serial interface |
| PDIUSBD11NB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:BUS CONTROLLER |
| PDIUSBD12 | 制造商:Panasonic Industrial Company 功能描述:IC |
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