參數(shù)資料
型號: PCF8576C
廠商: NXP Semiconductors N.V.
英文描述: Universal LCD driver for low multiplex rates
中文描述: 通用LCD驅(qū)動器的低復(fù)用率
文件頁數(shù): 34/40頁
文件大?。?/td> 243K
代理商: PCF8576C
1998 Feb 06
34
Philips Semiconductors
Product specification
Universal LCD driver for low multiplex
rates
PCF8576
12.1
Chip-on-glass cascadability in single plane
In chip-on-glass technology, where driver devices are
bonded directly onto glass of the LCD, it is important that
the devices may be cascaded without the crossing of
conductors, but the paths of conductors can be continued
on the glass under the chip. All of this is facilitated by the
PCF8576 bonding pad layout (see Fig.30). Pads needing
bus interconnection between all PCF8576s of the cascade
are V
DD
, V
SS
, V
LCD
, CLK, SCL, SDA and SYNC. These
lines may be led to the corresponding pads of the next
PCF8576 through the wide opening between V
LCD
pad
and the backplane output pads. The only bus line that does
not require a second opening to lead through to the next
PCF8576 is V
LCD
, being the cascade centre. The placing
of V
LCD
adjacent to V
SS
allows the two supplies to be
connected together.
When an external clocking source is to be used, OSC of all
devices should be connected to V
DD
.
The pads OSC, A0, A1, A2 and SA0 have been placed
between V
SS
and V
DD
to facilitate wiring of oscillator,
hardware subaddress and slave address.
13 BONDING PAD LOCATIONS
Fig.30 Bonding pad locations.
Bonding pad dimensions: 120
×
120
μ
m.
handbook, full pagewidth
MBK282
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S
S
S
S
S
S
S
S
S
S
S
S
S
S
S3
S2
S1
S0
BP3
BP1
BP2
BP0
VLCD
VSS
SA0
A2
A
A
O
V
C
S
S
S
S
S
S
S
S
S33
S32
S31
S30
S29
S28
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
S
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14
PCF8576
x
y
0
0
cascade
centre
3.07 mm
4.12
mm
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