參數(shù)資料
型號： PCD6003U
廠商： NXP SEMICONDUCTORS
元件分類： 通信及網(wǎng)絡(luò)
英文描述： Digital telephone answering machine chip
中文描述： SPECIALTY TELECOM CIRCUIT, UUC
文件頁數(shù)： 2/96頁
文件大小： 385K
代理商： PCD6003U
2001 Apr 17
2
Philips Semiconductors
Product specification
Digital telephone answering machine chip
PCD6003
CONTENTS
1
2
2.1
3
4
5
6
6.1
6.2
6.3
7
7.1
7.2
7.3
8
8.1
8.2
9
FEATURES
APPLICATION SUMMARY
Metalink emulation
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING INFORMATION
Pinning
Pin description
Pin types
FUNCTIONAL DESCRIPTION
Architecture
I/O summary
Overview of functional description
POWER SUPPLY, RESET AND START-UP
Power supply
Reset and start-up
TICB - GENERATION AND SELECTION OF
SYSTEM CLOCKS
Microprocessor, DSP, CODEC and IOM clock
generation
System clocks
Real-Time Clock generation
THE MICROCONTROLLER
Microcontroller architecture
Memory mapping
SFR mapping
Microcontroller interrupts
Interface to DSP
Interface to Real-Time Clock (RTC)
Interface to the Memory Control Block (MCB)
The test registers CDTRx, PMTRx and TCTRL
Interface to Timing and Control Block (TICB)
Power and Interrupt Control Register (PCON)
I
2
C-bus
MSK modem
LE control
DSP I/O REGISTERS
Interface to CODEC
9.1
9.2
9.3
10
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
10.10
10.11
10.12
10.13
11
11.1
12
12.1
12.2
EXTERNAL MEMORY INTERFACE
Supported flash memories
DTAM external interface during target
debugging
THE CODECs
Definitions
CODEC architecture
ANALOG VOLTAGE REFERENCE (AVR)
Bandgap reference
Analog Voltage Source (AVS)
IOM
Features
Pin description
Functional description
IOM data buffers
IOM Control Register (IOMC)
Timing
EXTERNAL I/O INTERFACES
External analog interfaces
External digital Interfaces
ELECTRICAL CHARACTERISTICS
Limiting values
Supply characteristics
Digital I/O
Analog supplies and general purpose ADC and
DAC
CODECs
APPLICATION DIAGRAMS
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C COMPONENTS
13
13.1
13.2
14
14.1
14.2
15
15.1
15.2
15.3
15.4
15.5
15.6
16
16.1
16.2
17
17.1
17.2
17.3
17.4
17.5
18
19
20
20.1
20.2
20.3
20.4
20.5
21
22
23
24
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