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參數(shù)資料
| 型號(hào)： | PCA9506DGG,518 |
| 廠商： | NXP Semiconductors |
| 文件頁(yè)數(shù)： | 22/34頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC I/O EXPANDER I2C 40B 56TSSOP |
| 標(biāo)準(zhǔn)包裝： | 2,000 |
| 接口： | I²C |
| 輸入/輸出數(shù)： | 40 |
| 中斷輸出： | 是 |
| 頻率 - 時(shí)鐘： | 400kHz |
| 電源電壓： | 2.3 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 56-TFSOP（0.240"，6.10mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 56-TSSOP |
| 包裝： | 帶卷 (TR) |
| 包括： | POR |
| 其它名稱： | 935280798518 PCA9506DGG-T PCA9506DGG-T-ND |
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PCA9505_9506
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 3 August 2010
29 of 34
NXP Semiconductors
PCA9505/06
40-bit I2C-bus I/O port with RESET, OE and INT
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 22) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 12 and 13
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 22.
Table 12.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 13.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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| PCA9507 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2-wire serial bus extender for HDMI DDC I2C-bus and SMBus |
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