參數(shù)資料
型號(hào)： PC107AMGHU100LC
廠商： ATMEL CORP
元件分類： 外設(shè)及接口
英文描述： PCI Bridge Memory Controller
中文描述： MULTIFUNCTION PERIPHERAL, CBGA503
封裝： 33 X 33 MM, HITCE, CERAMIC, BGA-503
文件頁(yè)數(shù)： 16/50頁(yè)
文件大?。?/td> 453K
代理商： PC107AMGHU100LC
16
PC107A [Preliminary]
2137C–HIREL–03/04
Package Thermal
Characteristics for HiTCE
Table 5 provides the package thermal characteristics for the PC107 HiTCE.
Notes:
1. Nominal values: means computed with nominal geometry and nominal thermal conductivities of materials as given in legend
of each simulation results.
2. In this case thermal resistance junction to case is thermal resistance junction to top of Silicon die, and value almost not
depend from substrate used for land grid array. Value depends strongly on heating zone size in Silicon chip assumption. In
present simulations heating zone is 5.8 mm × 3.65 mm that is 42% of die size. Assuming the full die size as uniformly power
dissipating is not realistic.
Assuming 8.3 mm × 5.15 mm heating zone (85% of die surface) leads to 0.15
°
C/watt instead of 0.29
°
C/watt.
Table 5.
Package Thermal Characteristics for HiTCE Package
(1)
Characteristic
Value
Unit
°
C/Watt
°
C/Watt
°
C/Watt
°
C/Wat
t
PC107 HiTCE
Thermal resistance junction to case
(2)
0.295
Thermal resistance junction to bottom of balls
15.8
Thermal resistance junction to board, Jedec JESD51-8 (2s2p board)
18.4
Thermal resistance junction to ambient, Jedec JESD51-2
(2s2p board = 2 signals + 2 power planes in board)
26.3
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參數(shù)描述
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