參數(shù)資料
型號: P89LPC932A1FA,112
廠商: NXP Semiconductors
文件頁數(shù): 40/64頁
文件大?。?/td> 0K
描述: IC 80C51 MCU FLASH 8K 28-PLCC
產(chǎn)品培訓模塊: Migrating from 8/16-Bit MCUs to 32-Bit ARMs
標準包裝: 37
系列: LPC900
核心處理器: 8051
芯體尺寸: 8-位
速度: 18MHz
連通性: I²C,SPI,UART/USART
外圍設備: 欠壓檢測/復位,LED,POR,PWM,WDT
輸入/輸出數(shù): 26
程序存儲器容量: 8KB(8K x 8)
程序存儲器類型: 閃存
RAM 容量: 768 x 8
電壓 - 電源 (Vcc/Vdd): 2.4 V ~ 3.6 V
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 28-PLCC
包裝: 管件
產(chǎn)品目錄頁面: 706 (CN2011-ZH PDF)
配用: DB-TSSOP-LPC932-ND - BOARD FOR LPC932 TSSOP
622-1014-ND - BOARD FOR LPC9XX TSSOP
622-1008-ND - BOARD FOR LPC9103 10-HVSON
622-1006-ND - SOCKET ADAPTER BOARD
568-4000-ND - DEMO BOARD SPI/I2C TO DUAL UART
568-3510-ND - DEMO BOARD SPI/I2C TO UART
622-1003-ND - KIT FOR LCD DEMO
622-1002-ND - USB IN-CIRCUIT PROG LPC9XX
568-1759-ND - EMULATOR DEBUGGER/PROGRMMR LPC9X
568-1758-ND - BOARD EVAL FOR LPC93X MCU FAMILY
其它名稱: 568-4279-5
935276131112
P89LPC932A1FA
P89LPC932A1_3
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 12 March 2007
45 of 64
NXP Semiconductors
P89LPC932A1
8-bit microcontroller with accelerated two-clock 80C51 core
8.
Limiting values
[1]
The following applies to Table 7 “Limiting values”:
a) This product includes circuitry specically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
b) Parameters are valid over operating temperature range unless otherwise specied. All voltages are with respect to VSS unless
otherwise noted.
Table 7.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
Tamb(bias)
operating bias ambient temperature
55
+125
°C
Tstg
storage temperature range
65
+150
°C
IOH(I/O)
HIGH-level output current per I/O pin
-
20
mA
IOL(I/O)
LOW-level output current per I/O pin
-
20
mA
II/O(tot)(max)
maximum total I/O current
-
100
mA
Vn
voltage on any pin (except VSS)
with respect to VDD
-
+3.5
V
Ptot(pack)
total power dissipation per package
based on package heat
transfer, not device power
consumption
-
1.5
W
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