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參數(shù)資料
| 型號： | P89LPC931 |
| 英文描述： | 8-bit microcontrollers with two-clock 80C51 core 4 kB/8 kB 3 V Flash with 256-byte data RAM |
| 中文描述： | 8位微控制器兩個(gè)小時(shí)80C51的核心4 KB的/ 8 KB的256 3伏閃存內(nèi)存字節(jié)的數(shù)據(jù) |
| 文件頁數(shù)： | 51/54頁 |
| 文件大?。?/td> | 1015K |
| 代理商： | P89LPC931 |
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Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
Product data
Rev. 03 — 06 October 2003
51 of 54
9397 750 12122
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Hot bar soldering or manual soldering is suitable for PMFP packages.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| P89LPC9311FDH,129 | 功能描述:8位微控制器 -MCU PREF PART P89LPC931FDH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| P89LPC9311FDH-S | 功能描述:8位微控制器 -MCU PRF PRT P89LPC931FDH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| P89LPC931A1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller with accelerated two-clock 80C51 core 4 kB/8 kB 3 V byte-erasable flash |
| P89LPC931A1FDH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontroller with accelerated two-clock 80C51 core 4 kB/8 kB 3 V byte-erasable flash |
| P89LPC931A1FDH,512 | 功能描述:8位微控制器 -MCU IC 80C51 MCU FLASH 8K RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
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