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參數(shù)資料
| 型號(hào)： | P12611EJ1V0AN00 |
| 英文描述： | MCU CMOS 28 LD 20MHZ 8K FLASH, -40C to +85C, 28-SOIC 300mil, TUBE |
| 中文描述： | uPB1509GV 1 GHz的輸入除以2。 4。 8預(yù)分頻器集成電路便攜式無(wú)線(xiàn)電系統(tǒng) |
| 文件頁(yè)數(shù)： | 7/19頁(yè) |
| 文件大?。?/td> | 110K |
| 代理商： | P12611EJ1V0AN00 |
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1
1. INTRODUCTION
In the consumer electronic appliances, the proportion of portable to stationary models has been considerably
growing these days. Especially in portable radios and wireless transceivers, pocket-size appliances instead of the
conventional carrying types are leading this market. What is more, due to small size and light weight, battery
downsizing and lower operating voltage are needed. Based on the trend of portable appliances utilizing RF waves,
the ICs in these appliances are also required to have a smaller size and a lower operating voltage .
In order to meet these requirements, NEC, which had marketed products with the part number
μ
PB5xx as
conventional-type prescaler ICs, has recently developed and released the
μ
PB1509GV low-voltage shrink package
prescaler IC.
This document describes the features and application examples for this IC.
2. PRODUCT OUTLINE
2.1 Features
The
μ
PB1509GV is a monolithic silicon IC designed as a prescaler for portable radio systems. This IC can be
used as the front-end prescaler for the PLL frequency synthesizer incorporated in the 17K Series of DTS controllers.
The greatest difference with the previous prescaler IC of
μ
PB587G is that the μPB1509GV uses a shrink package to
reduce the space in the application set. Although the pin pitch of this shrink package is narrower than
μ
PB587G, a
high isolation is achieved by using the same pin configuration as for NEC’s conventional products, arranging input
and output pins back-to-back, and devising internal circuit designs. Table 2-1 shows the comparison of
characteristics with the conventional product and Figure 2-1 compares the dimensions of these products.
Table 2-1. Characteristic Comparison with the
μ
PB587G
Part Number
I
CC
(mA)
V
CC
(V)
Divide
by 2
Mode
f
in
(MHz)
Divide
by 4
Mode
f
in
(MHz)
Divide
by 8
Mode
f
in
(MHz)
Package
Pin
Configuration
μ
PB587G
5.5
2.2 to 3.5
50 to 300
50 to 600
50 to
1000
8-pin plastic SOP (225 mil)
μ
PB1509GV
5.0
2.2 to 5.5
50 to 700
50 to 800
50 to
1000
8-pin plastic SSOP (175 mil)
Figure 2-1. 8-Pin Plastic SOP (225 mil) vs. 8-Pin Plastic SSOP (175 mil)
8-pin plastic SOP (225 mil)
8-pin plastic SSOP (175 mil)
8
5
1
4
5.37 MAX.
0.40
+0.10
–0.05
0.12 M
1.27
1
1
0
0.78 MAX.
0
1.1
4.4
6.5 ± 0.3
Detail of lead end
0.10
S8GM-50-225B-4
3
0.6 ± 0.2
8
5
1
4
3.0 MAX.
1
1
0
0.575 MAX.
0.65
0.3
+0.10
–0.05
0.10
M
0.15
0
0.5 ± 0.2
3.2
±
0.1
4.94
±
0.2
0.87
±
0.2
Detail of lead end
3
NEC original
configuration
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