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參數(shù)資料
| 型號： | P02221B2P |
| 廠商： | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| 英文描述： | 500mW InGaP HBT Amplifier |
| 中文描述： | 500mW的InGaP HBT寬頻放大器 |
| 文件頁數(shù)： | 4/6頁 |
| 文件大?。?/td> | 193K |
| 代理商： | P02221B2P |
Attention to Heat Radiation
In the layout design of the printed circuit board (PCB) on
which the InGaP HBT Amplifier are attached, the heat
radiation to minimize the device junction temperature should
be taken into account, since it significantly affects the MTTF
and RF performance. In any environment, the junction
temperature should be lower than the absolute maximum
rating during the device operation and it is recommended
that the thermal design has enough margin.
The junction temperature can be calculated by the following
formula.
T
jmax
=(Vd*Id-P
out
)(R
th
+R
board
+R
hs
)+T
a
Vd: Device voltage
Id: Device current
P
out
: Output power
R
th
: Thermal resistance between junction and case
R
board
: Thermal resistance of PCB
R
hs
: Thermal resistance of heat sink
T
a
: Ambient temperature
T
jmax
: Maximum junction temperature
Generally, there are two ways of heat radiation. One is the
plated thru hole and the other is the heat sink. Key points will
be illustrated in each case below. Note that no measure
against oscillation is adopted in the figures. In the design of
circuit and layout, you should take stabilizing into account if
necessary.
[Using Thru Hole]
Technical Note
P02221B2P
500mW InGaP HBT Amplifier
Specifications and information are subject to change without notice. 2005-07
Eudyna Devices Inc. 1,Kanai-cho, Sakae-ku, Yokohama, 244-0845 Japan
Phone : +81-45-853-8150 Fax : +81-45-853-8170 e-mail : www-sales-s@eudyna.com Web Site : www.eudyna.com
□
Multiple plated thru holes are required directly below the
device.
□
Place more than 2 machine screws as close to the ground
pin (pin 4) as possible. The PCB is screwed on the
mounting plate or the heat sink to lower the thermal
resistance of the PCB.
□
Lay out a large ground pad area with multiple plated thru
holes around pin 4 of the device.
□
The required matching and feedback circuit described in
the application circuit examples should be connected to the
device, although it is not shown in the figure below.
[Using Heat Sink]
φ
0.4 Plated Thru Holes
for 2.5 Machine Screws
Package Outline
4-R0.3
Heatsink
(4-R0.3)
2
0
φ
5 Soldermask Keepout
for 2.5 Machine Screws
φ
5 Soldermask Keepout
Grand Plane
Grand Plane
φ
3 Plated Thru Hole
1.9
×
2.85
2
φ
3 Plated Thru Hole
If you cannot get the junction temperature lower than the
absolute maximum rating only with the plated thru holes,
then you need to employ the heat sink. Attaching the heat
sink directly under pin 4 of the device improves the thermal
resistance between junction and ambient.
[Note]
□
Ground/thermal vias are critical for the proper device
performance. Drills of the recommended diameters should
be used in the fabrication of vias.
□
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
□
Mounting screws can be added near the part to fasten the
board to heat sink. Ensure that the ground/thermal via
region contacts the heat sink.
□
Do not put solder mask on the backside of the PCB in the
region where the board contacts the heat sink.
□
RF trace width depends upon the PCB material and
construction.
□
Use 1 oz. Copper minimum.
φ
0.4 Plated Thru Holes
φ
0.3 Plated Thru Holes
φ
5 Soldermask Keepout
Package Outline
Keepout
for 2.5 Machine Screws
Grand Plane
φ
5 Soldermask
φ
3 Plated Thru Hole
for 2.5 Machine Screws
φ
3 Plated Thru Hole
-4-
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