參數(shù)資料
型號： ORSO42G5-1BM484I
廠商： Lattice Semiconductor Corporation
文件頁數(shù)： 11/153頁
文件大小： 0K
描述： IC FPSC TRANSCEIVER 4CH 484-BGA
產(chǎn)品變化通告： Product Discontinuation 01/Aug/2011
標準包裝： 60
系列： *
Lattice Semiconductor
ORCA ORSO42G5 and ORSO82G5 Data Sheet
108
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of this data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
The ORCA Series 4 FPSCs include circuitry designed to protect the chips from damaging substrate injection cur-
rents and to prevent accumulations of static charge. Nevertheless, conventional precautions should be observed
during storage, handling, and use to avoid exposure to excessive electrical stress.
Table 37. Absolute Maximum Ratings
Recommended Operating Conditions
Table 38. Recommended Operating Conditions
SERDES Electrical and Timing Characteristics
Table 39. Maximum Power Dissipation
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TSTG
-65
150
°C
Power Supply Voltage with Respect to Ground
VDD33
-0.3
4.2
V
VDDIO
-0.3
4.2
V
VDD15, VDD_ANA, VDDGB
-0.3
2.0
V
Input Signal with Respect to Ground
VIN
VSS - 0.3
VDDIO + 0.3
V
Signal Applied to High-Impedance Output
—
VSS - 0.3
VDDIO + 0.3
V
Maximum Package Body (Soldering) Temperature
—
220
°C
Parameter
Symbol
Min.
Max.
Units
Power Supply Voltage
with Respect to Ground
1
VDD33
3.0
3.6
V
VDD15
1.425
1.575
V
Input Voltages
VIN
VSS - 0.3
VDDIO + 0.3
V
Junction Temperature
TJ
-40
125
°C
SERDES Supply Voltage
VDD_ANA, VDDGB
1.425
1.575
V
SERDES CML I/O Supply Voltage
VDDIB, VDDOB
1.425
1.89
V
1. For FPGA Recommended Operating Conditions and Electrical Characteristics, see the Recommended Operating Conditions and Electrical
Characteristics tables in the ORCA Series 4 FPGA data sheet (OR4E04) and technical note TN1036, ORCA Series 4 I/O User’s Guide.
FPSC Standby Currents (IDDSB15 and IDDSB33) are tested with the Embedded Core in the powered down state.
Parameter
Conditions
Min.
Typ.
Max.
1
Units
Power Dissipation
ORSO82G5
SERDES, MUX/DEMUX, Align FIFO and I/O (Per Channel), 1.25 Gbit/s
—
195
mW
SERDES, MUX/DEMUX, Align FIFO and I/O (Per Channel), 2.5 Gbit/s
—
225
mW
Logic Active in Both SONET and Cell Modes (Per Channel)
—
25
mW
Logic Active Only in Cell Mode (Per Channel)
—
10
mW
Power Dissipation
ORSO42G5
SERDES, MUX/DEMUX, Align FIFO and I/O (Per Channel), 1.25 Gbit/s
—
265
mW
SERDES, MUX/DEMUX, Align FIFO and I/O (Per Channel), 2.5 Gbit/s
—
295
mW
Logic Active in Both SONET and Cell Modes (Per Channel)
—
25
mW
Logic Active Only in Cell Mode (Per Channel)
—
10
mW
1. With all channels operating, 1.575V supply.
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ORSO42G5-1BMN484C 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 204 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
ORSO42G5-1BMN484I 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 204 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
ORSO42G5-2BM484C 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 204 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
ORSO42G5-2BM484I 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 204 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
ORSO42G5-2BMN484C 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 204 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
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