![](http://datasheet.mmic.net.cn/370000/OR2T04A-2PS84_datasheet_16726875/OR2T04A-2PS84_115.png)
Data Sheet
June 1999
ORCA Series 2 FPGAs
Lucent Technologies Inc.
115
L4
T23
T4
L11
L12
L13
L14
L15
L16
M11
M12
M13
M14
M15
M16
N11
N12
N13
N14
N15
N16
P11
P12
P13
P14
P15
P16
R11
R12
R13
R14
R15
R16
T11
T12
T13
T14
T15
T16
V
DD
V
DD
V
DD
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
DD
V
DD
V
DD
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
DD
V
DD
V
DD
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
DD
V
DD
V
DD
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
DD
V
DD
V
DD
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
DD
V
DD
V
DD
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
V
SS
—ETC
Pin Information
(continued)
Table 27. OR2C/2T10A, OR2C/2T12A, OR2C/2T15A/B, OR2C/2T26A, and OR2T40A/B 352-Pin PBGA
Pinout
(continued)
Pin
2C/2T10A Pad
2C/2T12A Pad
2C/2T15A/B Pad
2C/2T26A Pad OR2T40A/B Pad
Function
Notes:
The pins labeled I/O-V
DD
5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to V
DD
5 for the OR2TxxA series.
The pins labeled V
SS
-ETC are the 6 x 6 array of thermal balls located at the center of the package. The balls can be attached to the ground plane
of the board for enhanced thermal capability (see Table 29), or they can be left unconnected.