- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383714 > OR2T04A-3S208 (Electronic Theatre Controls, Inc.) Field-Programmable Gate Arrays PDF資料下載
參數(shù)資料
| 型號(hào)： | OR2T04A-3S208 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 元件分類： | FPGA |
| 英文描述： | Field-Programmable Gate Arrays |
| 中文描述： | 現(xiàn)場(chǎng)可編程門陣列 |
| 文件頁(yè)數(shù)： | 126/192頁(yè) |
| 文件大?。?/td> | 3148K |
| 代理商： | OR2T04A-3S208 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)當(dāng)前第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)
Lucent Technologies Inc.
126
Data Sheet
June 1999
ORCA Series 2 FPGAs
Package Thermal Characteristics
There are three thermal parameters that are in com-
mon use:
Θ
JA
,
ψ
JC, and
Θ
JC
. It should be noted that all
the parameters are affected, to varying degrees, by
package design (including paddle size) and choice of
materials, the amount of copper in the test board or
system board, and system airflow.
The data base containing the thermal values for all of
Lucent Technologies’ IC packages is currently being
updated to conform to modern JEDEC standards.
Thus, Table 29 contains the currently available thermal
specifications for Lucent Technologies’ FPGA pack-
ages mounted on both JEDEC and non-JEDEC test
boards. The thermal values for the newer package
types correspond to those packages mounted on a
JEDEC four-layer board (indicated as Note 2 in the
table). The values for the older packages, however, cor-
respond to those packages mounted on a non-JEDEC,
single-layer, sparse copper board (see Note 1). It
should also be noted that the values for the older pack-
ages are considered conservative.
Θ
JA
This is the thermal resistance from junction to ambient
(a.k.a. theta-JA, R-theta, etc.).
where T
J
is the junction temperature, T
A
is the ambient
air temperature, and Q is the chip power.
Experimentally,
Θ
JA
is determined when a special ther-
mal test die is assembled into the package of interest,
and the part is mounted on the thermal test board. The
diodes on the test chip are separately calibrated in an
oven. The package/board is placed either in a JEDEC
natural convection box or in the wind tunnel, the latter
for forced convection measurements. A controlled
amount of power (Q) is dissipated in the test chip’s
heater resistor, the chip’s temperature (T
J
) is deter-
mined by the forward drop on the diodes, and the ambi-
ent temperature (T
A
) is noted. Note that
Θ
JA
is
expressed in units of °C/watt.
ψ
JC
This JEDEC designated parameter correlates the junc-
tion temperature to the case temperature. It is generally
used to infer the junction temperature while the device
is operating in the system. It is not considered a true
thermal resistance, and it is defined by:
where T
C
is the case temperature at top dead center,
T
J
is the junction temperature, and Q is the chip power.
During the
Θ
JA
measurements described above,
besides the other parameters measured, an additional
temperature reading, T
C
, is made with a thermocouple
attached at top-dead-center of the case.
ψ
JC
is also
expressed in units of °C/watt.
Θ
JC
This is the thermal resistance from junction to case. It
is most often used when attaching a heat sink to the
top of the package. It is defined by:
The parameters in this equation have been defined
above. However, the measurements is performed with
the case of the part pressed against a water-cooled
heat sink so as to draw most of the heat generated by
the chip out the top of the package. It is this difference
in the measurement process that differentiates
Θ
JC
from
ψ
JC.
Θ
JC
is a true thermal resistance and is
expressed in units of °C/watt.
Θ
JB
This is the thermal resistance from junction to board
(a.k.a.,
Θ
JL)
. It is defined by:
J
T
B
–
Q
where T
B
is the temperature of the board adjacent to a
lead measured with a thermocouple. The other param-
eters on the right-hand side have been defined above.
This is considered a true thermal resistance, and the
measurement is made with a water-cooled heat sink
pressed against the board so as to draw most of the
heat out of the leads. Note that
Θ
JB
is expressed in
units of °C/watt, and that this parameter and the way it
is measured is still in JEDEC committee.
Θ
JA
J
T
T
A
–
Q
=
ψ
JC
J
T
T
C
–
Q
=
Θ
JC
J
T
T
C
–
Q
=
Θ
JB
T
=
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| OR2T04A-3S208I | Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 100pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1206; Termination: Solder Coated SnPb; Body Dimensions: 0.125" x 0.062" x 0.051"; Container: Bag; Features: MIL-PRF-55681: S Failure Rate |
| OR2T04A-3S84 | Field-Programmable Gate Arrays |
| OR2T04A-3S84I | Field-Programmable Gate Arrays |
| OR2T04A-4BA208 | Field-Programmable Gate Arrays |
| OR2T04A-4BA208I | Field-Programmable Gate Arrays |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| OR2T04A-3S208I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field-Programmable Gate Arrays |
| OR2T04A-3S84 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field-Programmable Gate Arrays |
| OR2T04A-3S84I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field-Programmable Gate Arrays |
| OR2T04A-3T100 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field-Programmable Gate Arrays |
| OR2T04A-3T100I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field-Programmable Gate Arrays |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。