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參數(shù)資料
| 型號： | OPA567AIRHGRG4 |
| 廠商： | Texas Instruments |
| 文件頁數(shù)： | 8/26頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP GP R-R 1.2MHZ 12VQFN |
| 標準包裝： | 2,500 |
| 放大器類型： | 通用 |
| 電路數(shù)： | 1 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 1.2 V/µs |
| 增益帶寬積： | 1.2MHz |
| 電流 - 輸入偏壓： | 1pA |
| 電壓 - 輸入偏移： | 500µV |
| 電流 - 電源： | 9mA |
| 電流 - 輸出 / 通道： | 2.4A |
| 電壓 - 電源，單路/雙路(±)： | 2.5 V ~ 5.5 V，±1.25 V ~ 2.75 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 12-VQFN 裸露焊盤 |
| 供應商設備封裝： | 12-VQFN-EP（5x5） |
| 包裝： | 帶卷 (TR) |
OPA567
SBOS287A
16
www.ti.com
FIGURE 6. Enable/Shutdown Control Using T
FLAG Pin and
External Control Signal.
Any tendency to activate the thermal protection circuit indi-
cates excessive power dissipation or an inadequate heat
sink. For reliable, long term, continuous operation, the junc-
tion temperature should be limited to 125
°C maximum. To
estimate the margin of safety in a complete design (including
heat sink), increase the ambient temperature until the ther-
mal protection is triggered. Use worst-case loading and
signal conditions. For good, long-term reliability, thermal
protection should trigger more than 25
°C above the maxi-
mum expected ambient conditions of your application. This
produces a junction temperature of 125
°C at the maximum
expected ambient condition.
Fast transients of large output current swings (for example,
switching quickly from sourcing 2A to sinking 2A) may cause
a glitch on the TFLAG pin. When switching large currents is
expected, the use of extra bypass between the supplies or a
low-pass filter on the TFLAG pin is recommended.
POWER DISSIPATION AND
SAFE OPERATING AREA
Power dissipation depends on power supply, signal, and load
conditions. It is dominated by the power dissipation of the
output transistors. For DC signals, power dissipation is equal
to the product of output current, IOUT and the output voltage
across the conducting output transistor (VS – VOUT). Dissipa-
tion with AC signals is lower. Application Bulletin SBOA022
explains how to calculate or measure power dissipation with
unusual signals and loads and can be found at the TI web
site (www.ti.com).
Output short-circuits are particularly demanding for the am-
plifier because the full supply voltage is seen across the
conducting transistor. It is very important to note that the
temperature protection will not shut the part down in over-
temperature conditions, unless the TFLAG pin is connected to
the Enable pin; see the section on Thermal Flag.
Figure 7 shows the safe operating area at room temperature
with various heatsinking efforts. Note that the safe output
current decreases as (VS – VOUT) increases. Figure 8 shows
the safe operating area at various temperatures with the
metal heatsink being soldered to a 2oz copper pad.
FIGURE 7. Safe Operating Area at Room Temperature.
FIGURE 8. Safe Operating Area at Various Ambient Tempera-
tures. Metal heat sink soldered to a 2oz copper pad.
The power that can be safely dissipated in the package is
related to the ambient temperature and the heatsink design.
The QFN package was specifically designed to provide
excellent power dissipation, but board layout greatly influ-
ences the heat dissipation of the package. Refer to
the QFN Package section for further details.
The OPA567 has a junction-to-ambient thermal resistance
(
θ
JA) value of 38°C/W when soldered to a 2oz copper plane.
This value can be further decreased by the addition of forced
air. See Figure 9 for the junction-to-ambient thermal resis-
tance of the QFN-12 package.
Junction temperature should be kept below 125
°C for reliable
operation. The junction temperature can be calculated by:
TJ = TA + PDθJA
where
θ
JA = θJC + θCA
TJ = Junction Temperature (°C)
TA = Ambient Temperature (°C)
PD = Power Dissipated (W)
θ
JA = Junction-to-Ambient Thermal Resistance
θ
JC = Junction-to-Case Thermal Resistance
θ
CA = Case-to-Air Thermal Resistance
Enable Pin
2, 3
11
8
9
T
FLAG Pin
Disable
On
10
AND
OPA567
10
1
0.1
V
S – VOUT (V)
SAFE OPERATING AREA
(T
A = 25°C)
Output
Current
(A)
01
2
3
4
5
6
Thermal pad soldered
to 2 oz. copper pad,
without forced air.
Thermal pad soldered
to 2 oz. copper pad,
with 500lfm airflow.
10
1
0.1
V
S – VOUT (V)
SAFE OPERATING AREA
Thermal Pad Soldered, Various T
A
Output
Current
(A)
01
2
3
4
5
6
T
A = +85°C
T
A = +25°C
T
A = –40°C
T
A = 0°C
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相關代理商/技術參數(shù) |
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| OPA567AIRHGT | 功能描述:運算放大器 - 運放 Rail-to-Rail I/O 2A Power Amplifier RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA567AIRHGT | 制造商:Texas Instruments 功能描述:IC OP-AMP GP R-R 1.2MHZ 12VQFN |
| OPA567AIRHGTG4 | 功能描述:運算放大器 - 運放 Rail-to-Rail I/O 2A Power Amplifier RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA569 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Power Op Amp. Output Signal Swings Within 200mV of Rails at 2A Output Current |
| OPA569AIDWP | 功能描述:運算放大器 - 運放 2A Pwr Op Amp Rail-To-Rail I/O RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
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