參數(shù)資料
型號(hào): NCP5005
廠商: ON SEMICONDUCTOR
英文描述: Compact Backlight LED Boost Driver(背光LED升壓驅(qū)動(dòng)器)
中文描述: 緊湊型背光LED升壓驅(qū)動(dòng)器(背光的LED升壓驅(qū)動(dòng)器)
文件頁數(shù): 23/23頁
文件大?。?/td> 239K
代理商: NCP5005
NCP5005
http://onsemi.com
23
PACKAGE DIMENSIONS
TSOP5
SN SUFFIX
CASE 48302
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
B
C
D
G
H
J
K
L
M
S
MIN
2.90
1.30
0.90
0.25
0.85
0.013
0.10
0.20
1.25
MAX
3.10 0.1142 0.1220
1.70 0.0512 0.0669
1.10 0.0354 0.0433
0.50 0.0098 0.0197
1.05 0.0335 0.0413
0.100 0.0005 0.0040
0.26 0.0040 0.0102
0.60 0.0079 0.0236
1.55 0.0493 0.0610
10
0
3.00 0.0985
MIN
MAX
INCHES
MILLIMETERS
0
10
2.50
0.1181
0.05 (0.002)
1
2
3
5
4
S
A
G
L
B
D
H
C
K
M
J
_
_
_
_
0.7
0.028
1.0
0.039
mm
inches
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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Phone
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NCP5005/D
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