參數(shù)資料
型號(hào)： NCP2809BMUTXG
廠商： ON Semiconductor
文件頁(yè)數(shù)： 19/24頁(yè)
文件大小： 0K
描述： IC HEADPHONE PWR AMP 135MW 10DFN
標(biāo)準(zhǔn)包裝： 3,000
系列： NOCAP™
類型： AB 類
輸出類型： 耳機(jī)，2-通道（立體聲）
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量： 135mW x 2 @ 16 歐姆
電源電壓： 2.2 V ~ 5.5 V
特點(diǎn)： 消除爆音，短路保護(hù)和熱保護(hù)，關(guān)閉
安裝類型： 表面貼裝
供應(yīng)商設(shè)備封裝： 10-UDFN（3x3）
封裝/外殼： 10-UFDFN 裸露焊盤
包裝： 帶卷 (TR)
NCP2809 Series
http://onsemi.com
4
PIN FUNCTION DESCRIPTION
Pin
Type
Symbol
Description
1
I
IN_R
Negative input of the second amplifier. It receives the audio input signal. Connected to the input
capicator Cin (NCP2809A) or the external Rin (NCP2809B).
2
I
SHUTDOWN
The device enters in shutdown mode when a a low level is applied on this pin.
3
I
BYPASS
Bypass capacitor pin which provides the common mode voltage (VP/2).
4
O
REF_I
Virtual ground amplifier feed back. This pin sets the stereo headset ground. In order to improve
crosstalk, this pin must be connected as close as possible to the ground connection of the headset
(ideally at the ground pin of the headset connector). When one uses bypassing capacitors, this pin
must be left unconnected.
5
I
IN_L
Negative input of the first amplifier. It receives the audio input signal. Connected to the input
capacitor Cin (NCP2809A) or the external Rin (NCP2809B).
6
O
OUT_L
Stereo headset amplifier analog output left. This pin will output the amplified analog signal and,
depending on the application, must be coupled with a capacitor or directly connected to the left
loudspeaker of the headset. This output is able to drive a 16 W load in a singleended configuration.
7
I
VP
Positive analog supply of the cell. Range: 2.2 V – 5.5 V
8
O
OUT_I
Virtual ground for stereo Headset common connection. This pin is directly connected to the
common connection of the headset when use of bypassing capacitor is not required. When one
uses bypassing capacitors, this pin must be left unconnected.
9
I
VM
Analog Ground
10
O
OUT_R
Stereo headset amplifier analog output right. This pin will output the amplified analog signal and,
depending on the application, must be coupled with a capacitor or directly connected to the right
loudspeaker of the headset. This output is able to drive a 16 W load in a singleended configuration.
MAXIMUM RATINGS (TA = +25°C)
Rating
Symbol
Value
Unit
Supply Voltage
Vp
6.0
V
Operating Supply Voltage
Op Vp
2.2 to 5.5
V
Input Voltage
Vin
0.3 to VCC + 0.3
V
Max Output Current
Iout
250
mA
Power Dissipation
Pd
Internally Limited
Operating Ambient Temperature
TA
40 to +85
°C
Max Junction Temperature
TJ
150
°C
Storage Temperature Range
Tstg
65 to +150
°C
Thermal Resistance, JunctiontoAir
Micro10
UDFN
RqJA
200
240
°C/W
ESD Protection
Human Body Model (HBM) (Note 1)
Machine Model (MM) (Note 2)
8000
200
V
Latch up current at Ta = 85_C (Note 3)
±100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Human Body Model, 100 pF discharged through a 1.5 kW resistor following specification JESD22/A114 8.0 kV can be applied on OUT_L,
OUT_R, REF_I and OUT_I outputs. For other pins, 2.0 kV is the specified voltage.
2. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
3. Maximum ratings per JEDEC standard JESD78.
*This device contains 752 active transistors and 1740 MOS gates.
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