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鍨嬭櫉锛� NBSG16MMNR2G
寤犲晢锛� ON Semiconductor
鏂囦欢闋佹暩(sh霉)锛� 4/11闋�
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鎻忚堪锛� IC RCVR/DRVR CML 2.5/3.3V 16-QFN
妯欐簴鍖呰锛� 3,000
椤炲瀷锛� 鏀剁櫦(f膩)鍣�
鎳�(y墨ng)鐢細 鍎€琛�
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
灏佽/澶栨锛� 16-VFQFN 瑁搁湶鐒婄洡
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 16-QFN锛�3x3锛�
鍖呰锛� 甯跺嵎 (TR)
NBSG16M
http://onsemi.com
2
VCC NC VEE VEE
VCC VBB VEE VEE
VCC
Q
VCC
VTD
D
VTD
5
678
16
15
14
13
12
11
10
9
1
2
3
4
NBSG16M
Exposed Pad (EP)
Figure 1. QFN16 Pinout (Top View)
Table 1. PIN DESCRIPTION
Pin
Name
I/O
Description
1
VTD
Internal 50 W Termination Pin. See Table 2. (Note 3)
2
D
LVDS, CML, ECL, LVTTL,
LVCMOS Input
Inverted Differential Input (Note 3)
3
D
LVDS, CML, ECL, LVTTL,
LVCMOS Input
Noninverted Differential Input. (Note 3)
4
VTD
Internal 50 W Termination Pin. See Table 2. (Note 3)
5
VCC
Positive Supply Voltage. All VCC pins must be externally connected to Power Supply to guar-
antee proper operation.
6
NC
No Connect (Note 1)
7
VEE
Negative Supply Voltage. All VEE pins must be externally connected to Power Supply to guar-
antee proper operation.
8
VEE
Negative Supply Voltage. All VEE pins must be externally connected to Power Supply to guar-
antee proper operation.
9
VCC
Positive Supply Voltage. All VCC pins must be externally connected to Power Supply to guar-
antee proper operation.
10
Q
CML Output
Noninverted CML Differential Output with Internal 50 W Source Termination Resistor. (Note 2)
11
Q
CML Output
Inverted CML Differential Output with Internal 50 W Source Termination Resistor. (Note 2)
12
VCC
Positive Supply Voltage. All VCC pins must be externally connected to Power Supply to guar-
antee proper operation.
13
VEE
Negative Supply Voltage. All VEE pins must be externally connected to Power Supply to guar-
antee proper operation.
14
VEE
Negative Supply Voltage. All VEE pins must be externally connected to Power Supply to guar-
antee proper operation.
15
VBB
Internally Generated ECL Reference Output Voltage
16
VCC
Positive Supply Voltage. All VCC pins must be externally connected to Power Supply to guar-
antee proper operation.
EP
The Exposed Pad (EP) and the QFN16 package bottom is thermally connected to the die
for improved heat transfer out of package. The exposed pad must be attached to a heat
sinking conduit. The pad is not electrically connected to the die but may be electrically and
thermally connected to VEE on the PC board.
1. The NC pins are electrically connected to the die and MUST be left open.
2. CML outputs require 50 W receiver termination resistor to VCC for proper operation.
3. In the differential configuration when the input termination pin (VTD, VTD) are connected to a common termination voltage, and if no signal
is applied then the device will be susceptible to selfoscillation.
鐩搁棞(gu膩n)PDF璩囨枡
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