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參數(shù)資料
| 型號： | NAND512R4A1AN1T |
| 廠商： | NUMONYX |
| 元件分類： | PROM |
| 英文描述： | 32M X 16 FLASH 1.8V PROM, 15000 ns, PDSO48 |
| 封裝： | 12 X 20 MM, PLASTIC, TSOP-48 |
| 文件頁數(shù)： | 9/56頁 |
| 文件大?。?/td> | 882K |
| 代理商： | NAND512R4A1AN1T |
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NAND128-A, NAND256-A, NAND512-A, NAND01G-A
BUS OPERATIONS
There are six standard bus operations that control
the memory. Each of these is described in this
section, see Table 5., Bus Operations, for a sum-
mary.
Command Input
Command Input bus operations are used to give
commands to the memory. Command are accept-
ed when Chip Enable is Low, Command Latch En-
able is High, Address Latch Enable is Low and
Read Enable is High. They are latched on the ris-
ing edge of the Write Enable signal.
Only I/O0 to I/O7 are used to input commands.
See Figure 25. and Table 20. for details of the tim-
ings requirements.
Address Input
Address Input bus operations are used to input the
memory address. Three bus cycles are required to
input the addresses for the 128Mb and 256Mb de-
vices and four bus cycles are required to input the
addresses for the 512Mb and 1Gb devices (refer
The addresses are accepted when Chip Enable is
Low, Address Latch Enable is High, Command
Latch Enable is Low and Read Enable is High.
They are latched on the rising edge of the Write
Enable signal. Only I/O0 to I/O7 are used to input
addresses.
See Figure 26. and Table 20. for details of the tim-
ings requirements.
Data Input
Data Input bus operations are used to input the
data to be programmed.
Data is accepted only when Chip Enable is Low,
Address Latch Enable is Low, Command Latch
Enable is Low and Read Enable is High. The data
is latched on the rising edge of the Write Enable
signal. The data is input sequentially using the
Write Enable signal.
tails of the timings requirements.
Data Output
Data Output bus operations are used to read: the
data in the memory array, the Status Register, the
Electronic Signature and the Serial Number.
Data is output when Chip Enable is Low, Write En-
able is High, Address Latch Enable is Low, and
Command Latch Enable is Low.
The data is output sequentially using the Read En-
able signal.
See Figure 28. and Table 21. for details of the tim-
ings requirements.
Write Protect
Write Protect bus operations are used to protect
the memory against program or erase operations.
When the Write Protect signal is Low the device
will not accept program or erase operations and so
the contents of the memory array cannot be al-
tered. The Write Protect signal is not latched by
Write Enable to ensure protection even during
power-up.
Standby
When Chip Enable is High the memory enters
Standby mode, the device is deselected, outputs
are disabled and power consumption is reduced.
Table 5. Bus Operations
Note: 1. Only for x16 devices.
2. WP must be VIH when issuing a program or erase command.
Bus Operation
E
AL
CL
R
W
WP
I/O0 - I/O7
I/O8 - I/O15(1)
Command Input
VIL
VIH
Rising
X(2)
Command
X
Address Input
VIL
VIH
VIL
VIH
Rising
X
Address
X
Data Input
VIL
VIH
Rising
X
Data Input
Data Output
VIL
Falling
VIH
X
Data Output
Write Protect
XXXXX
VIL
XX
Standby
VIH
XXXXX
X
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NAND512R4A2CWFD | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND512R4A2CZA6 | 制造商:Micron Technology Inc 功能描述:512MB. 3V X8 NO OPTION TSOP48TSOP-1 48 12X20 AL 42 - Trays |
| NAND512R4A2DDI6 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND512W3A0AN6 | 功能描述:閃存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結(jié)構(gòu):256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| NAND512W3A0AN6E | 功能描述:閃存 2.7-3.6V 512M(64Mx8) RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結(jié)構(gòu):256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
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