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參數(shù)資料
| 型號： | NAND512R3A2CN1F |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | PROM |
| 英文描述： | 64M X 8 FLASH 1.8V PROM, 35 ns, PDSO48 |
| 封裝： | 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48 |
| 文件頁數(shù)： | 50/57頁 |
| 文件大?。?/td> | 916K |
| 代理商： | NAND512R3A2CN1F |
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NAND128-A, NAND256-A, NAND512-A, NAND01G-A
54/57
APPENDIX A. HARDWARE INTERFACE EXAMPLES
Nand Flash devices can be connected to a micro-
controller system bus for code and data storage.
For microcontrollers that have an embedded
NAND controller the NAND Flash can be connect-
ed without the addition of glue logic (see
Figure 43.). However a minimum of glue logic is
required for general purpose microcontrollers that
do not have an embedded NAND controller. The
glue logic usually consists of a flip-flop to hold the
Chip Enable, Address Latch Enable and Com-
mand Latch Enable signals stable during com-
mand and address latch operations, and some
logic gates to simplify the firmware or make the de-
sign more robust.
Figure 44. gives an example of how to connect a
NAND Flash to a general purpose microcontroller.
The additional OR gates allow the microcontrol-
ler’s Output Enable and Write Enable signals to be
used for other peripherals. The OR gate between
A3 and CSn maps the flip-flop and NAND I/O in
different address spaces inside the same chip se-
lect unit, which improves the setup and hold times
and simplifies the firmware. The structure uses the
microcontroller DMA (Direct Memory Access) en-
gines to optimize the transfer between the NAND
Flash and the system RAM.
For any interface with glue logic, the extra delay
caused by the gates and flip-flop must be taken
into account. This delay must be added to the mi-
crocontroller’s AC characteristics and register set-
tings to get the NAND Flash setup and hold times.
For mass storage applications (hard disk emula-
tions or systems where a huge amount of storage
is required) NAND Flash memories can be con-
nected together to build storage modules (see Fig-
Figure 43. Connection to Microcontroller, Without Glue Logic
AI08045b
R
W
I/O
E
AL
CL
W
G
CSn
AD(24:16)
Microcontroller
NAND
Flash
DQ
WP
RB
PWAITEN
AD17
AD16
VDD
VDD or VSS
or General Purpose I/O
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| NAND512R3A2CZA6E | 功能描述:IC FLASH 512MBIT 63VFBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步，DDR II 存儲容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應商設備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ |
| NAND512R3A2CZA6F | 制造商:Micron Technology Inc 功能描述:SLC NAND Flash Parallel 1.8V 512Mbit 64M x 8bit 15us 63-Pin VFBGA T/R |
| NAND512R3A2DDI6 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND512R3A2DZA6E | 功能描述:IC FLASH 512MBIT 63VFBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:1,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應商設備封裝:8-MFP 包裝:帶卷 (TR) |
| NAND512R3A2SE06 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
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