參數(shù)資料
型號： NAND128W3A0AN6F
廠商： STMICROELECTRONICS
元件分類： PROM
英文描述： 16M X 8 FLASH 3V PROM, 35 ns, PDSO48
封裝： 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48
文件頁數(shù)： 19/57頁
文件大?。?/td> 916K
代理商： NAND128W3A0AN6F
NAND128-A, NAND256-A, NAND512-A, NAND01G-A
26/57
Copy Back Program
The Copy Back Program operation is used to copy
the data stored in one page and reprogram it in an-
other page.
The Copy Back Program operation does not re-
quire external memory and so the operation is
faster and more efficient because the reading and
loading cycles are not required. The operation is
particularly useful when a portion of a block is up-
dated and the rest of the block needs to be copied
to the newly assigned block.
If the Copy Back Program operation fails an error
is signalled in the Status Register. However as the
standard external ECC cannot be used with the
Copy Back operation bit error due to charge loss
cannot be detected. For this reason it is recom-
mended to limit the number of Copy Back opera-
tions on the same data and or to improve the
performance of the ECC.
The Copy Back Program operation requires three
steps:
1.
The source page must be read using the Read
A command (one bus write cycle to setup the
command and then 4 bus write cycles to input
the source page address). This operation
copies all 264 Words/ 528 Bytes from the page
into the Page Buffer.
2.
When the device returns to the ready state
(Ready/Busy High), the second bus write
cycle of the command is given with the 4 bus
cycles to input the target page address. Refer
to Table 10. for the addresses that must be the
same for the Source and Target pages.
3.
Then the confirm command is issued to start
the P/E/R Controller.
After a Copy Back Program operation, a partial-
page program is not allowed in the target page un-
til the block has been erased.
See Figure 18. for an example of the Copy Back
operation.
Table 10. Copy Back Program Addresses
Note: 1. DD = Dual Die.
Figure 18. Copy Back Operation
Density
Same Address for Source and
Target Pages
128 Mbit
A23
256 Mbit
A24
512 Mbit
A25
512 Mbit DD(1)
A24, A25
1 Gbit DD(1)
A25, A26
I/O
RB
Source
Address Inputs
SR0
ai07590b
8Ah
70h
00h
Copy Back
Code
Read
Code
Read Status Register
Target
Address Inputs
tBLBH1
(Read Busy time)
10h
Busy
tBLBH2
(Program Busy time)
相關PDF資料
PDF描述
NAND128W3A0AV6F 16M X 8 FLASH 3V PROM, 35 ns, PDSO48
NAND01GR4A2BZB1F 64M X 16 FLASH 1.8V PROM, 35 ns, PBGA63
NAND01GR4A2CZB1E 64M X 16 FLASH 1.8V PROM, 35 ns, PBGA63
NAND256W3A2BV1T 32M X 8 FLASH 3V PROM, 35 ns, PDSO48
NAND01GR4A2BN1T 64M X 16 FLASH 1.8V PROM, 35 ns, PDSO48
相關代理商/技術參數(shù)
參數(shù)描述
NAND128W3A0BN6E 功能描述:閃存 2.7-3.6V 128M(16Mx8) RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel
NAND128W3A0BN6F 功能描述:閃存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel
NAND128W3A2BDI6 制造商:Micron Technology Inc 功能描述:NAND 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film
NAND128W3A2BN6E 功能描述:閃存 NAND 128 MEG RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel
NAND128W3A2BN6F 功能描述:閃存 NAND 128 MEG RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*