參數(shù)資料
型號(hào)： NAND08GR3B3BZC6E
廠商： STMICROELECTRONICS
元件分類： PROM
英文描述： 1G X 8 FLASH 1.8V PROM, 35 ns, PBGA63
封裝： 9.50 X 12 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, LFBGA-63
文件頁(yè)數(shù)： 53/59頁(yè)
文件大?。?/td> 998K
代理商： NAND08GR3B3BZC6E
57/59
NAND512-B, NAND01G-B, NAND02G-B, NAND04G-B, NAND08G-B
PART NUMBERING
Table 31. Ordering Information Scheme
Devices are shipped from the factory with the memory content bits, in valid blocks, erased to ’1’. For further
information on any aspect of this device, please contact your nearest ST Sales Office.
Example:
NAND02GR3B
2
A ZA
1
T
Device Type
NAND Flash Memory
Density
512 = 512Mb
01G = 1Gb
02G = 2Gb
04G = 4Gb
08G = 8Gb
Operating Voltage
R = VDD = 1.7 to 1.95V
W = VDD = 2.7 to 3.6V
Bus Width
3 = x8
4 = x16
Family Identifier
B = 2112 Bytes/ 1056 Word Page
Device Options
2 = Chip Enable Don't Care Enabled
3 = Chip Enable Don't Care Enabled and Automatic Page 0 Read at Power-up
Product Version
A = First Version
B= Second Version
C= Third Version
Package
N = TSOP48 12 x 20mm (all devices)
V = USOP48 12 x 17 x 0.65mm (512Mb and 1Gb devices)
ZA = VFBGA63 9.5 x 12 x 1mm, 0.8mm pitch (512Mb and 1Gb devices)
ZB = TFBGA63 9.5 x 12 x 1.2mm, 0.8mm pitch (2Gb Dual Die devices)
ZC = LFBGA63 9.5 x 12 x 1.4mm, 0.8mm pitch (8Gb Quadruple Die devices)
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
blank = Standard Packing
T = Tape & Reel Packing
E = Lead Free Package, Standard Packing
F = Lead Free Package, Tape & Reel Packing
相關(guān)PDF資料
PDF描述
NAND08GR3B3CN1E 1G X 8 FLASH 1.8V PROM, 35 ns, PDSO48
NAND08GW4B2CZC1F 512M X 16 FLASH 3V PROM, 35 ns, PBGA63
NAND08GW4B3AZC6 512M X 16 FLASH 3V PROM, 35 ns, PBGA63
NAND08GW4B3BN1T 512M X 16 FLASH 3V PROM, 35 ns, PDSO48
NAND08GW4B3BN6E 512M X 16 FLASH 3V PROM, 35 ns, PDSO48
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
NAND08GR3B4CZL6E 制造商:Micron Technology Inc 功能描述:NAND - Trays
NAND08GR3B4CZL6F 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel
NAND08GW3B2AN6E 功能描述:閃存 4 GBit 2112 Byte 1056 WP 1.8v/3v RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問(wèn)時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
NAND08GW3B2AN6F 功能描述:閃存 4 GB 2112B 1056 Word Pg 1.8V/3V RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問(wèn)時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
NAND08GW3B2BN6E 制造商:Micron Technology Inc 功能描述:NAND & S.MEDIA FLASH - Trays
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