參數(shù)資料
型號: NAND01GW4A3AN1T
廠商: STMICROELECTRONICS
元件分類: PROM
英文描述: 64M X 16 FLASH 3V PROM, 12000 ns, PDSO48
封裝: 12 X 20 MM, PLASTIC, TSOP-48
文件頁數(shù): 48/56頁
文件大?。?/td> 882K
代理商: NAND01GW4A3AN1T
NAND128-A, NAND256-A, NAND512-A, NAND01G-A
52/56
PART NUMBERING
Table 28. Ordering Information Scheme
Devices are shipped from the factory with the memory content bits, in valid blocks, erased to ’1’.
For further information on any aspect of this device, please contact your nearest ST Sales Office.
Example:
NAND512R3A
0
A ZA
1
T
Device Type
NAND = NAND Flash Memory
Density
128 = 128Mb
256 = 256Mb
512 = 512Mb
01G = 1Gb
Operating Voltage
R = VDD = 1.7 to 1.95V
W = VDD = 2.7 to 3.6V
Bus Width
3 = x8
4 = x16
Family Identifier
A = 528 Bytes/ 264 Word Page
Device Options
0 = No Options
1 = Automatic Page 0 Read at Power-up
2 = Chip Enable Don’t Care Enabled
3 = Chip Enable Don’t Care Enabled and Automatic Page 0 Read at Power-up
Product Version
A = 120nm process technology
(Single Die 128Mb, 256Mb, 512Mb) (Dual Die 512Mb, 1Gb)
Package
N = TSOP48 12 x 20mm (all devices)
V = WSOP48 12 x 17 x 0.65mm (128Mbit, 256Mbit and 512Mbit devices)
ZA = VFBGA55 8 x 10 x 1mm, 6x8 ball array, 0.8mm pitch (128Mbit and 256Mbit devices)
ZB = TFBGA55 8 x 10 x 1.2mm, 6x8 ball array, 0.8mm pitch (512Mbit Dual Die devices)
ZA = VFBGA63 8.5 x 15 x 1mm, 6x8 ball array, 0.8mm pitch (512Mbit devices)
ZB = TFBGA63 8.5 x 15 x 1.2mm, 6x8 ball array, 0.8mm pitch (1Gbit Dual Die devices)
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
blank = Standard Packing
T = Tape & Reel Packing
E = Lead Free Package, Standard Packing
F = Lead Free Package, Tape & Reel Packing
相關(guān)PDF資料
PDF描述
NAND01GW4A1AZB1E 64M X 16 FLASH 3V PROM, 12000 ns, PBGA63
NAND256W3A1AV1T 32M X 8 FLASH 3V PROM, 10000 ns, PDSO48
NAND256R4A1AN1 16M X 16 FLASH 1.8V PROM, 10000 ns, PDSO48
NAND256R4A3AN1 16M X 16 FLASH 1.8V PROM, 10000 ns, PDSO48
NAND256R4A3AZA1T 16M X 16 FLASH 1.8V PROM, 10000 ns, PBGA55
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