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參數(shù)資料

型號(hào)：	NAND01GW3A0CZB1
廠商：	STMICROELECTRONICS
元件分類：	PROM
英文描述：	128M X 8 FLASH 3V PROM, 35 ns, PBGA63
封裝：	9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, TFBGA-63
文件頁(yè)數(shù)：	45/57頁(yè)
文件大小：	916K
代理商：	NAND01GW3A0CZB1

5/57

NAND128-A, NAND256-A, NAND512-A, NAND01G-A

Behavioral simulation models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

IBIS simulations models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

PROGRAM AND ERASE TIMES AND ENDURANCE CYCLES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Table 14. Program, Erase Times and Program Erase Endurance Cycles . . . . . . . . . . . . . . . . . . . 33

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Table 15. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Table 16. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Table 17. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Table 18. DC Characteristics, 1.8V Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Table 19. DC Characteristics, 3V Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Table 20. AC Characteristics for Command, Address, Data Input . . . . . . . . . . . . . . . . . . . . . . . . . 37

Table 21. AC Characteristics for Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Figure 23.Command Latch AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Figure 24.Address Latch AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Figure 25.Data Input Latch AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Figure 26.Sequential Data Output after Read AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Figure 27.Read Status Register AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Figure 28.Read Electronic Signature AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Figure 29.Page Read A/ Read B Operation AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Figure 30.Read C Operation, One Page AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Figure 31.Page Program AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Figure 32.Block Erase AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Figure 33.Reset AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Ready/Busy Signal Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Figure 34.Ready/Busy AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Figure 35.Ready/Busy Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Figure 36.Resistor Value Versus Waveform Timings For Ready/Busy Signal . . . . . . . . . . . . . . . . 46

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Figure 37.TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Outline . . . . . . . . . 47

Table 22. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data . 47

Figure 38.USOP48 – lead Plastic Ultra Thin Small Outline,12 x 17mm, Package Outline . . . . . . . 48

Table 23. USOP48 – lead Plastic Ultra Thin Small Outline, 12 x 17mm, Package Mechanical Data48

Figure 39.VFBGA55 8 x 10mm - 6x8 active ball array, 0.80mm pitch, Package Outline . . . . . . . . 49

Table 24. VFBGA55 8 x 10mm - 6x8 ball array, 0.80mm pitch, Package Mechanical Data . . . . . . 49

Figure 40.TFBGA55 8 x 10mm - 6x8 active ball array - 0.80mm pitch, Package Outline . . . . . . . . 50

Table 25. TFBGA55 8 x 10mm - 6x8 active ball array - 0.80mm pitch, Package Mechanical Data 50

Figure 41.VFBGA63 9x11mm - 6x8 active ball array, 0.80mm pitch, Package Outline . . . . . . . . . 51

Table 26. VFBGA63 9x11mm - 6x8 active ball array, 0.80mm pitch, Package Mechanical Data . . 51

Figure 42.TFBGA63 9x11mm - 6x8 active ball array, 0.80mm pitch, Package Outline. . . . . . . . . . 52

Table 27. TFBGA63 9x11mm - 6x8 active ball array, 0.80mm pitch, Package Mechanical Data . . 52

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相關(guān)代理商/技術(shù)參數(shù)	參數(shù)描述
NAND01GW3A0CZB1E	制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories
NAND01GW3A0CZB1F	制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories
NAND01GW3A0CZB1T	制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories
NAND01GW3A0CZB6	制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories
NAND01GW3A0CZB6E	制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories

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