參數(shù)資料
型號: MTD20N06HDL
廠商: MOTOROLA INC
元件分類: JFETs
英文描述: TMOS POWER FET LOGIC LEVEL 20 AMPERES 60 VOLTS RDS(on) = 0.045 OHM
中文描述: 20 A, 60 V, 0.045 ohm, N-CHANNEL, Si, POWER, MOSFET
文件頁數(shù): 5/12頁
文件大?。?/td> 274K
代理商: MTD20N06HDL
5
Motorola TMOS Power MOSFET Transistor Device Data
QG, TOTAL GATE CHARGE (nC)
RG, GATE RESISTANCE (Ohms)
t
V
V
Figure 7. Gate–To–Source and Drain–To–Source
Voltage versus Total Charge
1
10
100
1000
10
1
100
VDD = 30 V
ID = 20 A
VGS = 10 V
TJ = 25
°
C
tr
tf
td(on)
td(off)
Figure 8. Resistive Switching Time
Variation versus Gate Resistance
0
2
4
8
12
18
16
6
10
14
10
6
2
0
8
4
12
60
50
40
30
10
20
0
QT
Q2
VGS
ID = 20 A
TJ = 25
°
C
VDS
Q3
Q1
DRAIN–TO–SOURCE DIODE CHARACTERISTICS
The switching characteristics of a MOSFET body diode
are very important in systems using it as a freewheeling or
commutating diode. Of particular interest are the reverse re-
covery characteristics which play a major role in determining
switching losses, radiated noise, EMI and RFI.
System switching losses are largely due to the nature of
the body diode itself. The body diode is a minority carrier
device, therefore it has a finite reverse recovery time, trr, due
to the storage of minority carrier charge, QRR, as shown in
the typical reverse recovery wave form of Figure 10. It is this
stored charge that, when cleared from the diode, passes
through a potential and defines an energy loss. Obviously,
repeatedly forcing the diode through reverse recovery further
increases switching losses. Therefore, one would like a
diode with short trr and low QRR specifications to minimize
these losses.
The abruptness of diode reverse recovery effects the
amount of radiated noise, voltage spikes, and current ring-
ing. The mechanisms at work are finite irremovable circuit
parasitic inductances and capacitances acted upon by high
di/dts. The diode’s negative di/dt during ta is directly con-
trolled by the device clearing the stored charge. However,
the positive di/dt during tb is an uncontrollable diode charac-
teristic and is usually the culprit that induces current ringing.
Therefore, when comparing diodes, the ratio of tb/ta serves
as a good indicator of recovery abruptness and thus gives a
comparative estimate of probable noise generated. A ratio of
1 is considered ideal and values less than 0.5 are considered
snappy.
Compared to Motorola standard cell density low voltage
MOSFETs, high cell density MOSFET diodes are faster
(shorter trr), have less stored charge and a softer reverse
recovery characteristic. The softness advantage of the high
cell density diode means they can be forced through reverse
recovery at a higher di/dt than a standard cell MOSFET
diode without increasing the current ringing or the noise gen-
erated. In addition, power dissipation incurred from switching
the diode will be less due to the shorter recovery time and
lower switching losses.
I
VSD, SOURCE–TO–DRAIN VOLTAGE (Volts)
0.50
0.66
0.82
0
8
12
16
20
Figure 9. Diode Forward Voltage versus Current
4
0.58
0.74
0.90
18
14
10
6
2
VGS = 0 V
TJ = 25
°
C
0.98
相關PDF資料
PDF描述
MTD20P03 TMOS POWER FET LOGIC LEVEL 19 AMPERES 30 VOLTS RDS(on) = 0.099 OHM
MTD20N06 TMOS POWER FET 20 AMPERES 60 VOLTS RDS(on) = 0.080 OHM
MTD20P06 TMOS POWER FET LOGIC LEVEL 15 AMPERES 60 VOLTS RDS(on) = 175 MOHM
MTD20P03HDL TMOS POWER FET LOGIC LEVEL 19 AMPERES 30 VOLTS RDS(on) = 0.099 OHM
MTD20P06HDL TMOS POWER FET LOGIC LEVEL 15 AMPERES 60 VOLTS RDS(on) = 175 MOHM
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