
3
8Mb: 512K x 18, 256K x 32/36 3.3V I/O, Pipelined, DCD SyncBurst SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT58L512L18D_C.p65 – Rev. 6/01
2001, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
3.3V I/O, PIPELINED, DCD SYNCBURST SRAM
Address and write control are registered on-chip to
simplify WRITE cycles. This allows self-timed WRITE
cycles. Individual byte enables allow individual bytes
to be written. During WRITE cycles on the x18 device,
BWa# controls DQas and DQPa; BWb# controls DQbs
and DQPb. During WRITE cycles on the x32 and x36
devices, BWa# controls DQas and DQPa; BWb# con-
trols DQbs and DQPb; BWc# controls DQcs and DQPc;
BWd# controls DQds and DQPd. GW# LOW causes all
bytes to be written. Parity bits are only available on the
x18 and x36 versions.
This device incorporates an additional pipelined
enable register which delays turning off the output
buffer an additional cycle when a deselect is executed.
This feature allows depth expansion without penaliz-
ing system performance.
Micron’s 8Mb SyncBurst SRAMs operate from a
+3.3V VDD power supply, and all inputs and outputs are
TTL-compatible. The device is ideally suited for
Pentium and PowerPC pipelined systems and systems
that benefit from a very wide, high-speed data bus. The
device is also ideal in generic 16-, 18-, 32-, 36-, 64-, and
72-bit-wide applications.
TQFP PINOUTS
At the time of the writing of this data sheet, there are
two pinouts in the industry. Micron will support both
pinouts for this part.
GENERAL DESCRIPTION
The Micron SyncBurst SRAM family employs
high-speed, low-power CMOS designs that are fabri-
cated using an advanced CMOS process.
Micron’s 8Mb SyncBurst SRAMs integrate a 512K x
18, 256K x 32, or 256K x 36 SRAM core with advanced
synchronous peripheral circuitry and a 2-bit burst
counter. All synchronous inputs pass through registers
controlled by a positive-edge-triggered single-clock in-
put (CLK). The synchronous inputs include all ad-
dresses, all data inputs, active LOW chip enable (CE#),
two additional chip enables for easy depth expansion
(CE2, CE2#), burst control inputs (ADSC#, ADSP#,
ADV#), byte write enables (BWx#) and global write
(GW#). Note that CE2# is not available on the
T Version.
Asynchronous inputs include the output enable
(OE#), clock (CLK) and snooze enable (ZZ). There is also
a burst mode input (MODE) that selects between inter-
leaved and linear burst modes. The data-out (Q), en-
abled by OE#, is also asynchronous. WRITE cycles can
be from one to two bytes wide (x18) or from one to four
bytes wide (x32/x36), as controlled by the write control
inputs.
Burst operation can be initiated with either address
status processor (ADSP#) or address status controller
(ADSC#) inputs. Subsequent burst addresses can be
internally generated as controlled by the burst advance
input (ADV#).