參數(shù)資料
型號(hào): MT58L128V18P
廠商: Micron Technology, Inc.
英文描述: 128K x 18, Pipelined, SCD SyncBurst SRAM(2Mb,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲(chǔ)器)
中文描述: 128K的× 18,流水線,SCD的SyncBurst的SRAM(處理器,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲(chǔ)器)
文件頁(yè)數(shù): 13/25頁(yè)
文件大?。?/td> 487K
代理商: MT58L128V18P
13
2Mb: 128K x 18, 64K x 32/36 Pipelined, SCD SyncBurst SRAM
MT58L128L18P_2.p65 – Rev. 8/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2000, Micron Technology, Inc.
2Mb: 128K x 18, 64K x 32/36
PIPELINED, SCD SYNCBURST SRAM
ABSOLUTE MAXIMUM RATINGS*
Voltage on V
DD
Supply
Relative to V
SS
..................................-0.5V to +4.6V
Voltage on V
DD
Q Supply
Relative to V
SS
..................................-0.5V to +4.6V
V
IN
.............................................. -0.5V to V
DD
Q + 0.5V
Storage Temperature (plastic) ........... -55°C to +150°C
Junction Temperature**................................... +150°C
Short Circuit Output Current .......................... 100mA
*Stresses greater than those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only, and functional
operation of the device at these or any other condi-
tions above those indicated in the operational sections
of this specification is not implied. Exposure to abso-
lute maximum rating conditions for extended periods
may affect reliability.
**Maximum junction temperature depends upon pack-
age type, cycle time, loading, ambient temperature,
and airflow. See Micron Technical Note TN-05-14 for
more information.
3.3V I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS
(0°C
T
A
+70°C; V
DD
, V
DD
Q = +3.3V +0.3V/-0.165V unless otherwise noted)
DESCRIPTION
Input High (Logic 1) Voltage
Input Low (Logic 0) Voltage
Input Leakage Current
Output Leakage Current
CONDITIONS
SY MBOL
V
IH
V
IL
IL
I
IL
O
MIN
2.0
-0.3
-1.0
-1.0
MA X
V
DD
+ 0.3
0.8
1.0
1.0
UNITS
V
V
μA
μA
NOTES
1, 2
1, 2
3
0V
V
IN
V
DD
Output(s) disabled,
0V
V
IN
V
DD
I
OH
= -4.0mA
I
OL
= 8.0mA
Output High Voltage
Output Low Voltage
Supply Voltage
Isolated Output Buffer Supply
V
OH
V
OL
V
DD
V
DD
Q
2.4
3.135
3.135
V
V
V
V
1, 4
1, 4
1
1, 5
0.4
3.6
3.6
NOTE:
1. All voltages referenced to V
SS
(GND).
2. Overshoot:
V
IH
+4.6V for t
t
KC/2 for I
20mA
Undershoot:
V
IL
3
-0.7V for t
t
KC/2 for I
20mA
Power-up:
V
IH
+3.6V and V
DD
3.135V for t
200ms
3. MODE pin has an internal pull-up, and input leakage = ±10μA.
4. The load used for V
OH
, V
OL
testing is shown in Figure 2 for 3.3V I/O and Figure 4 for 2.5V I/O. AC load current is higher
than the shown DC values. AC I/O curves are available upon request.
5. V
DD
Q should never exceed V
DD
. V
DD
and V
DD
Q can be connected together for 3.3V I/O.
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