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| 型號(hào)： | MSP430FW425IPM |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 16-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PQFP64 |
| 封裝： | GREEN, PLASTIC, QFP-64 |
| 文件頁數(shù)： | 27/61頁 |
| 文件大?。?/td> | 828K |
| 代理商： | MSP430FW425IPM |
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MSP430FW42x
www.ti.com
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
Crystal Oscillator, LFXT1 Oscillator
(1) (2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
OSCCAPx = 0h
0
OSCCAPx = 1h
10
CXIN
Integrated input capacitance(3)
2.2 V/3 V
pF
OSCCAPx = 2h
14
OSCCAPx = 3h
18
OSCCAPx = 0h
0
OSCCAPx = 1h
10
CXOUT Integrated output capacitance
(3)
2.2 V/3 V
pF
OSCCAPx = 2h
14
OSCCAPx = 3h
18
VIL
VSS
0.2 × VCC
Input levels at XIN(4)
2.2 V/3 V
V
VIH
0.8 × VCC
VCC
(1)
The parasitic capacitance from the package and board may be estimated to be 2 pF. The effective load capacitor for the crystal is (CXIN
× CXOUT) / (CXIN+ CXOUT). This is independent of XTS_FLL.
(2)
To improve EMI on the low-power LFXT1 oscillator, particularly in the LF mode (32 kHz), the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
(3)
External capacitance is recommended for precision real-time clock applications; OSCCAPx = 0h.
(4)
Applies only when using an external logic-level clock source. XTS_FLL must be set. Not applicable when using a crystal or resonator.
Copyright 2003–2011, Texas Instruments Incorporated
33
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| MSP430FW425IPMR | 功能描述:16位微控制器 - MCU for Elec Flow Meters RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT |
| MSP430FW427IPM | 功能描述:16位微控制器 - MCU for Elec Flow Meters RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT |
| MSP430FW427IPMR | 功能描述:16位微控制器 - MCU for Elec Flow Meters RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT |
| MSP430FW428IPMR | 功能描述:16位微控制器 - MCU Mixed Signal MCU RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT |
| MSP430FW429IPM | 功能描述:16位微控制器 - MCU Mixed Signal MCU RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT |
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