參數(shù)資料
型號(hào): MSM64172-XXX
廠商: LAPIS SEMICONDUCTOR CO LTD
元件分類(lèi): 微控制器/微處理器
英文描述: 4-BIT, MROM, 0.6 MHz, MICROCONTROLLER, UUC
封裝: DIE
文件頁(yè)數(shù): 24/30頁(yè)
文件大?。?/td> 239K
代理商: MSM64172-XXX
29/29
Semiconductor
MSM64172
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
QFP56-P-910-0.65-2K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.43 TYP.
Mirror finish
相關(guān)PDF資料
PDF描述
MSM6442-XXGS-K 4-BIT, MROM, 4.2 MHz, MICROCONTROLLER, PQFP80
MSM6502-GS-K 4-BIT, MROM, 0.032768 MHz, MICROCONTROLLER, PQFP56
MSM65352B-XXXGS-BK 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP64
MSM65353-XXXGS-BK4 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP100
MSM65353A-XXXGS-BK4 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP100
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