GNDSYN
參數(shù)資料
型號(hào): MSC8103VT1100F
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 5/104頁(yè)
文件大?。?/td> 0K
描述: IC DSP 16BIT 275MHZ 332-FCPBGA
標(biāo)準(zhǔn)包裝: 90
系列: StarCore
類(lèi)型: SC140 內(nèi)核
接口: 通信處理器模塊(CPM)
時(shí)鐘速率: 275MHz
非易失內(nèi)存: 外部
芯片上RAM: 512kB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.60V
工作溫度: -40°C ~ 105°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 332-BFBGA,F(xiàn)CPBGA
供應(yīng)商設(shè)備封裝: 332-FCBGA(17x17)
包裝: 托盤(pán)
MSC8103 Network Digital Signal Processor, Rev. 12
4-4
Freescale Semiconductor
Design Considerations
GNDSYN and GNDSYN1 should be provided with an extremely low impedance path to ground and should be bypassed
to VCCSYN and VCCSYN1, respectively, by a 0.01-F capacitor located as close as possible to the chip package. The
user should also bypass GNDSYN and GNDSYN1 to VCCSYN and VCCSYN1 with a 0.01-F capacitor as closely as
possible to the chip package
Figure 4-2.
VCCSYN and VCCSYN1 Bypass
VDD
0.01 F
10 F
VCCSYN
10
Ω
10nH
相關(guān)PDF資料
PDF描述
RBB10DHRD CONN CARD EXTEND 20POS .050"
VE-253-CW-F1 CONVERTER MOD DC/DC 24V 100W
EEC18DRXS CONN EDGECARD 36POS DIP .100 SLD
VE-25N-CW-F1 CONVERTER MOD DC/DC 18.5V 100W
EMM44DSXS CONN EDGECARD 88POS DIP .156 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MSC8103VT1200F 功能描述:IC DSP 16BIT 300MHZ 332-FCPBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:StarCore 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類(lèi)型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類(lèi)型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤(pán)
MSC81058 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS
MSC81090 制造商:ASI 制造商全稱(chēng):ASI 功能描述:NPN SILICON RF POWER TRANSISTOR
MSC81111 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS
MSC81118 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS