參數(shù)資料
型號(hào): MSC8101M1250C
廠商: MOTOROLA INC
元件分類: 數(shù)字信號(hào)處理
英文描述: Network Digital Signal Processor
中文描述: 64-BIT, 62.5 MHz, OTHER DSP, PBGA332
封裝: 17 X 17 MM, LIDDED FLIP CHIP, PLASTIC, BGA-332
文件頁(yè)數(shù): 2/104頁(yè)
文件大?。?/td> 877K
代理商: MSC8101M1250C
MSC8101 Technical Data, Rev. 16
ii
Freescale Semiconductor
Table of Contents
MSC8101 Features .................................................................................................................................................................................... iii
Target Applications.....................................................................................................................................................................................iv
Product Documentation ..............................................................................................................................................................................iv
Signals/Connections
1.1
Power Signals ........................................................................................................................................................................ 1-4
1.2
Clock Signals......................................................................................................................................................................... 1-4
1.3
Reset, Configuration, and EOnCE Event Signals.................................................................................................................. 1-5
1.4
System Bus, HDI16, and Interrupt Signals............................................................................................................................ 1-6
1.5
Memory Controller Signals .................................................................................................................................................1-13
1.6
CPM Ports............................................................................................................................................................................1-15
1.7
JTAG Test Access Port Signals............................................................................................................................................ 1-36
1.8
Reserved Signals.................................................................................................................................................................. 1-36
Physical and Electrical Specifications
2.1
Absolute Maximum Ratings.................................................................................................................................................. 2-1
2.2
Recommended Operating Conditions.................................................................................................................................... 2-2
2.3
Thermal Characteristics......................................................................................................................................................... 2-2
2.4
DC Electrical Characteristics................................................................................................................................................. 2-3
2.5
Clock Configuration .............................................................................................................................................................. 2-4
2.6
AC Timings............................................................................................................................................................................ 2-7
Packaging
3.1
FC-PBGA Package Description............................................................................................................................................. 3-1
3.2
Lidded FC-PBGA Package Mechanical Drawing...............................................................................................................3-31
Design Considerations
4.1
Thermal Design Considerations............................................................................................................................................. 4-1
4.2
Electrical Design Considerations........................................................................................................................................... 4-1
4.3
Power Considerations............................................................................................................................................................ 4-2
4.4
Layout Practices..................................................................................................................................................................... 4-3
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Ordering and Contact Information...............................................................................................................................Back Cover
Data Sheet Conventions
pin and pin-
out
OVERBAR
Although the device package does not have pins, the term pins and pin-out are used for
convenience and indicate specific signal locations within the ball-grid array.
Used to indicate a signal that is active when pulled low (For example, the
RESET
pin is active
when low.)
Means that a high true (active high) signal is high or that a low true (active low) signal is low
Means that a high true (active high) signal is low or that a low true (active low) signal is high
Signal/Symbol
Logic State
PIN
True
PIN
False
PIN
True
PIN
False
Values for V
IL
, V
OL
, V
IH
, and V
OH
are defined by individual product specifications.
“asserted”
“deasserted”
Examples:
Signal State
Asserted
Deasserted
Asserted
Deasserted
Voltage
V
IL
/V
OL
V
IH
/V
OH
V
IH
/V
OH
V
IL
/V
OL
Note:
相關(guān)PDF資料
PDF描述
MSC8101M1375C Network Digital Signal Processor
MSD601-RT1 NPN General Purpose Amplifier Transistors Surface Mount
MSD601-RT1 NPN General Purpose Amplifier Transistors Surface Mount
MSD601-ST1 NPN General Purpose Amplifier Transistors Surface Mount
MSD601-ST1 NPN General Purpose Amplifier Transistors Surface Mount
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MSC8101M1250F 功能描述:DSP 16BIT 250MHZ CPM 332-FCPBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:StarCore 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點(diǎn) 接口:I²C,McASP,McBSP 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA(27x27) 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
MSC8101M1375C 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Network Digital Signal Processor
MSC8101M1375F 功能描述:DSP 16BIT 275MHZ CPM 332-FCPBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:StarCore 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點(diǎn) 接口:I²C,McASP,McBSP 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA(27x27) 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
MSC8101M1500F 功能描述:DSP 16BIT 300MHZ CPM 332-FCPBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:StarCore 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點(diǎn) 接口:I²C,McASP,McBSP 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA(27x27) 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
MSC8101UG/D 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Network Digital Signal Processor