參數(shù)資料
型號: MPM22CGC600A
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 600 MHz, MICROPROCESSOR, XMA
封裝: MMC-2
文件頁數(shù): 61/68頁
文件大?。?/td> 966K
代理商: MPM22CGC600A
Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep Technology
58
Datasheet
243356-006
Figure 25. Standoff Holes, Board Edge Clearance, and EMI Containment Ring
6.3.2
Weight
The Pentium III processor mobile module featuring Intel SpeedStep technology weighs
approximately 56 grams.
Hole detail, 3 places
0.762 mm width of EMI containment ring
1.27+/- 0.19 mm board edge to EMI ring
2.54+/-0.19 mm keep-out area
3.81+/-0.19 mm board edge to hole centerline
3.81+/-0.19 mm
4.45 mm diameter grounded ring
+ 0.050 mm
- 0.025 mm
hole diameter
2.413 mm
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