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參數(shù)資料
| 型號(hào)： | MPM22CGA850B |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 850 MHz, MICROPROCESSOR, XMA |
| 封裝： | MMC-2 |
| 文件頁數(shù)： | 60/68頁 |
| 文件大?。?/td> | 966K |
| 代理商： | MPM22CGA850B |
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Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep Technology
243356-006
Datasheet
57
Figure 24. CPU Thermal Transfer Plate (Reference Only)
6.3
Mobile Module Physical Support
6.3.1
Mobile Module Mounting Requirements
Three mounting holes are available for securing the mobile module to the system base or the
system electronics. See Figure 18 for mounting hole locations. These hole locations and board edge
clearances will remain fixed for all Intel mobile modules. All three mounting holes should be used
to ensure long term mechanical reliability and EMI integrity of the system.
The board edge clearance includes a 0.762-mm (0.030 inches) wide EMI containment ring around
the perimeter of the mobile module. This ring is on each layer of the mobile module PCB and is
grounded. The hole patterns also have a plated surrounding ring to use a metal standoff for EMI
shielding purposes. Standoffs should be used to provide support for the installed mobile module.
However, the warpage of the baseboard can vary and should be calculated into the final dimensions
of the standoffs used. All calculations can be made with the Intel MMC-2 Standoff/Receptacle
Height Spreadsheet. Information on this spreadsheet can be obtained from your Intel Field
Representative.
Figure 25 shows the standoff support hole details, the board edge clearance, and the dimensions of
the EMI containment ring. No components are placed on the board in the keep-out area.
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