參數(shù)資料
型號(hào): MPM22CGA850B
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 850 MHz, MICROPROCESSOR, XMA
封裝: MMC-2
文件頁(yè)數(shù): 55/68頁(yè)
文件大?。?/td> 966K
代理商: MPM22CGA850B
Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep Technology
243356-006
Datasheet
53
6.0
Mechanical Specifications
This section provides the physical dimensions for the Pentium III processor mobile module
featuring Intel SpeedStep technology.
6.1
Mobile Module Dimensions
Figure 18 shows the mobile module board dimensions and the connector orientation.
Figure 18. Board Dimensions and MMC-2 Connector Orientation
6.1.1
Pin 1 Location of the MMC-2 Connector
Figure 19 shows the location of pin 1 of the 400-pin connector.
Module Mechanical X-Y-Z Dimensions and Thermal
Attach Points
Unless otherwise specified:
Tolerances
Angles
± 0.5°
.X
± 0.2
.XX
± 0.15
.XXX
± 0.075
* All Dimensions are in mm
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