參數(shù)資料
型號(hào)： MPE603PFE200LX
廠商： MOTOROLA INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 200 MHz, RISC PROCESSOR, CQFP240
封裝： 32 X 32 MM, 0.50 MM PITCH, CERAMIC, QFP-240
文件頁(yè)數(shù)： 13/36頁(yè)
文件大小： 201K
代理商： MPE603PFE200LX
PRELIMINAR
Y
20
EC603e Microprocessor Hardware Specifications (PID7v)
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
1.7 Package Descriptions
The following sections provide the package parameters and the mechanical dimensions for the PID7v. Note
that the PID7v is currently offered in two types of CQFP packages—the Motorola wire-bond CQFP and the
ceramic ball grid array (CBGA) package.
1.7.1 Motorola Wire-Bond CQFP Package Description
The following sections provide the package parameters and mechanical dimensions for the Motorola wire-
bond CQFP package.
1.7.1.1 Package Parameters
The package parameters are as provided in the following list. The package type is 32 mm x 32 mm, 240-pin
ceramic quad at pack.
Package outline
32 mm x 32 mm
Interconnects
240
Pitch
0.5 mm (20 mil)
TCK
C11
—
Input
TDI
A11
High
Input
TDO
A12
High
Output
TEA
H13
Low
Input
TLBISYNC
C04
Low
Input
TMS
B11
High
Input
TRST
C10
Low
Input
TS
J13
Low
I/O
TSIZ[0–2]
A13, D10, B12
High
Output
TT[0–4]
B13, A15, B16, C14, C15
High
I/O
WT
D02
Low
Output
VDD2
F06, F08, F09, F11, G07, G10, H06, H08, H09, H11, J06, J08, J09, J11,
K07, K10, L06, L08, L09, L11
——
VOLTDETGND3
F03
Low
Output
Notes:
1. These are test signals for factory use only and must be pulled up to OVdd for normal machine operation.
2. OVdd inputs supply power to the I/O drivers and Vdd inputs supply power to the processor core.
3. Internally tied to GND to indicate to the power supply that a low-voltage processor is present.
Table 11. Pinout Listing for the 255 CBGA Package (Continued)
Signal Name
Pin Number
Active
I/O
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