參數(shù)資料
型號: MPE603EFE100TX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 100 MHz, RISC PROCESSOR, CQFP240
封裝: 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
文件頁數(shù): 15/32頁
文件大?。?/td> 250K
代理商: MPE603EFE100TX
22
PID6-603e Hardware Specifications, Rev 2
1.7.2 CBGA Package Description
The following sections provide the package parameters and mechanical dimensions for the CBGA package.
1.7.2.1 Package Parameters
The package parameters are as provided in the following list. The package type is 21 x 21 mm, 255-pin
ceramic ball grid array (CBGA).
Package outline
21 mm
Interconnects
255
Pitch
1.27 mm
Minimum module height
2.45 mm
Maximum module height
3.00 mm
Ball diameter
0.89 mm (35 mil)
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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相關(guān)PDF資料
PDF描述
MPE603ERX100LX 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255
MPE603PFE200LX 32-BIT, 200 MHz, RISC PROCESSOR, CQFP240
MPE603PRX200LX 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
MPE603PFE166LX 32-BIT, 167 MHz, RISC PROCESSOR, CQFP240
MPE603RRX300LX 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
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