參數(shù)資料
型號(hào)： MPD78C12AGFA-XXX-3BE
元件分類： 微控制器/微處理器
英文描述： 8-BIT, MROM, 15 MHz, MICROCONTROLLER, PQFP64
封裝： 14 X 20 MM, 2.70 MM HEIGHT, PLASTIC, QFP-64
文件頁數(shù)： 52/62頁
文件大?。?/td> 617K
代理商： MPD78C12AGFA-XXX-3BE
PD78C10A(A), 78C11A(A), 78C12A(A)
54
9. RECOMMENDED SOLDERING CONDITIONS
Use the following recommended soldering conditions when solder-mounting the
PD78C10A(A), 78C11A(A),
or 78C12A(A).
For details of recommended soldering conditions, see the Semiconductor Device Mounting Technology
Manual (IEI-1207) in the information materials.
Consult your local NEC sales representative concerning soldering methods and conditions other than those
recommended.
Table 9-1. Soldering Conditions for Surface Mounting Types
(1)
PD78C10AGF(A)-3BE
: 64-pin plastic QFP (14 x 20 mm)
PD78C11AGF(A)-xxx-3BE : 64-pin plastic QFP (14 x 20 mm)
Caution
Do not use different soldering methods together (except when one method is pin partial
heating).
(2)
PD78C12AGF(A)-xxx-3BE: 64-pin plastic QFP (14 x 20 mm)
Caution
Do not use different soldering methods together (except when one method is pin partial
heating).
Soldering method
Infrared ray reflow
VPS
Wave soldering
Pin partial heating
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
-
Soldering conditions
Package peak temperature: 235
°C, Time: 30 seconds max. (210 °C
min.), Number of operations: 2 max.
<Cautions>
(1) Do not start the second reflow until the device has cooled to
normal temperature after the first reflow.
(2) Do not use water for flux cleaning after the first reflow.
Package peak temperature: 215
°C, Time: 40 seconds max. (200 °C
min.), Number of operations: 2 max.
<Cautions>
(1) Do not start the second reflow until the device has cooled to
normal temperature after the first reflow.
(2) Do not use water for flux cleaning after the first reflow.
Solder bath temperature: 260
°C max., Time: 10 seconds max.,
Number of operations: 1
Preheating temperature: 120
°C max. (package surface temperature)
Pin temperature: 300
°C max., Time: 3 seconds max. (per device side)
Soldering method
Infrared ray reflow
VPS
Wave soldering
Pin partial heating
Symbol
IR30-00-1
VP15-00-1
WS60-00-1
-
Soldering conditions
Package peak temperature: 230
°C, Time: 30 seconds max. (210 °C
min.), Number of operations: 1
Package peak temperature: 215
°C, Time: 40 seconds max. (200 °C
min.), Number of operations: 1
Solder bath temperature: 260
°C max., Time: 10 seconds max.,
Number of operations: 1
Preheating temperature: 120
°C max. (package surface temperature)
Pin temperature: 300
°C max., Time: 3 seconds max. (per device side)
5
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