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參數(shù)資料
| 型號(hào)： | MPD703224GC(A)-8EU |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | RISC MICROCONTROLLER, PQFP100 |
| 封裝： | 14 X 14 MM, 0.50 MM PITCH, LQFP-100 |
| 文件頁數(shù)： | 29/39頁 |
| 文件大?。?/td> | 337K |
| 代理商： | MPD703224GC(A)-8EU |
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35
DATA SHEET U15870EE1V1DS00
PD703223, PD703224, PD703225, PD703226
4.
Recommended Soldering Conditions
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document Semiconductor
Device:
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended please consult NEC.
Note: The number of days refers to storage at 25°C, 65% RH MAX after the dry pack has been
opened.
After that, prebaking is necessary at 125 °C for 10 to 72 hours.
Caution:
Do not use two or more soldering methods in combination (except partial heating
method).
Table 4-1:
Soldering Conditions
Soldering Method
Soldering Condition
Symbol of Recommended Soldering
Condition
Infrared reflow
Package peak temperature: 235°C,
Time: 30 seconds max. (210°C min.),
Number of times: 3 max.,
Number of days: 7 Note
IR35-107-3
VPS
Package peak temperature: 215°C,
Time: 30 seconds max. (210°C min.),
Number of times: 2 max.,
Number of days: 7 Note
VP15-207-2
Partial heating
Pin temperature: 300°C max.,
Time: 3 seconds max. (per side of device)
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