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    參數(shù)資料
    

    


    


    
型號：
MPC880VR133

    

    
廠商：
Freescale Semiconductor

    

    
文件頁數(shù)：
4/87頁

    

    
文件大小：
0K

    

    
描述：
IC MPU POWERQUICC 133MHZ 357PBGA

    

    
標準包裝：
44

    

    
系列：
MPC8xx

    

    
處理器類型：
32-位 MPC8xx PowerQUICC
    		

    

    
速度：
133MHz
    		

    

    
電壓：
3.3V
    		

    

    
安裝類型：
表面貼裝
    		

    

    
封裝/外殼：
357-BBGA
    		

    

    
供應商設備封裝：
357-PBGA（25x25）
    		

    

    
包裝：
托盤
    		

    

    

    

	
    
    
    

    
    
	
    MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7
    12
    Freescale Semiconductor
    Thermal Calculation and Measurement
    7
    Thermal Calculation and Measurement
    For the following discussions, PD= (VDDL × IDDL) + PI/O, where PI/O is the power dissipation of the I/O
    drivers.
    NOTE
    The VDDSYN power dissipation is negligible.
    7.1
    Estimation with Junction-to-Ambient Thermal Resistance
    An estimation of the chip junction temperature, T
    J, in °C can be obtained from the following equation:
    TJ = TA + (RθJA × PD)
    where:
    TA = ambient temperature (C)
    RθJA = package junction-to-ambient thermal resistance (C/W)
    PD = power dissipation in package
    The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
    estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
    that errors of a factor of two (in the quantity TJ – TA) are possible.
    Output high voltage, IOH = –2.0 mA, except XTAL and open-drain pins
    VOH
    2.4
    —
    V
    Output low voltage
    IOL = 2.0 mA (CLKOUT)
    IOL = 3.2 mA
    5
    IOL = 5.3 mA
    6
    IOL = 7.0 mA (TXD1/PA14, TXD2/PA12)
    IOL = 8.9 mA (TS, TA, TEA, BI, BB, HRESET, SRESET)
    VOL
    —0.5
    V
    1 The difference between V
    DDL and VDDSYN cannot be more than 100 mV.
    2 The signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], PE(14:31), TDI, TDO, TCK, TRST, TMS, MII1_TXEN, MII_MDIO are 5-V
    tolerant. The minimum voltage is still 2.0 V.
    3 V
    IL(max) for the I
    2C interface is 0.8 V rather than the 1.5 V as specified in the I2C standard.
    4 Input capacitance is periodically sampled.
    5 A(0:31), TSIZ0/REG, TSIZ1, D(0:31), IRQ(2:4), IRQ6, RD/WR, BURST, IP_B(3:7), PA(0:11), PA13, PA15, PB(14:31),
    PC(4:15), PD(3:15), PE(14:31), MII1_CRS, MII_MDIO, MII1_TXEN, and MII1_COL.
    6 BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:7), WE(0:3), BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
    GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A, OP(0:3), and
    BADDR(28:30).
    Table 6. DC Electrical Specifications (continued)
    Characteristic
    Symbol
    Min
    Max
    Unit
    
    
    
    
    
    


    


    

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    相關(guān)代理商/技術(shù)參數(shù)
    		

    參數(shù)描述
    		

    
    

    
MPC880VR133
 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 133MHZ BGA-357

    

    
MPC880VR66
功能描述:微處理器 - MPU 66 MHz 87 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
MPC880VR66
 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 66MHZ BGA-357

    

    
MPC880VR80
功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
MPC880ZP133
功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
    
    
    
	
    	
    
    
     
     
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