參數(shù)資料
型號: MPC8541ECPXALF
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù): 51/88頁
文件大小: 1110K
代理商: MPC8541ECPXALF
MPC8541E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
Freescale Semiconductor
55
Package and Pin Listings
14.2
Mechanical Dimensions of the FC-PBGA
Figure 41 the mechanical dimensions and bottom surface nomenclature of the MPC8541E 783 FC-PBGA
package.
Figure 41. Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA
Notes:
1.
All dimensions are in millimeters.
2.
Dimensions and tolerances per ASME Y14.5M-1994.
3.
Maximum solder ball diameter measured parallel to datum A.
4.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
5.
Capacitors may not be present on all devices.
6.
Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.
7.
The socket lid must always be oriented to A1.
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