參數(shù)資料
型號: MPC8540VT833LC
廠商: Freescale Semiconductor
文件頁數(shù): 18/104頁
文件大小: 0K
描述: MPU POWERQUICC III 783FCPBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 833MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 784-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8540 Integrated Processor Hardware Specifications, Rev. 4.1
20
Freescale Semiconductor
DDR SDRAM
Figure 6 shows the DDR SDRAM output timing diagram.
Figure 6. DDR SDRAM Output Timing Diagram
6.2.2.2
Load Effects on Address/Command Bus
Table 18 provides approximate delay information that can be expected for the address and command
signals of the DDR controller for various loadings. These numbers are the result of simulations for one
topology. The delay numbers will strongly depend on the topology used. These delay numbers show the
total delay for the address and command to arrive at the DRAM devices. The actual delay could be
different than the delays seen in simulation, depending on the system topology. If a heavily loaded system
is used, the DLL loop may need to be adjusted to meet setup requirements at the DRAM.
Table 18. Expected Delays for Address/Command
Load
Delay
Unit
4 devices (12 pF)
3.0
ns
9 devices (27 pF)
3.6
ns
36 devices (108 pF) + 40 pF compensation capacitor
5.0
ns
36 devices (108 pF) + 80 pF compensation capacitor
5.2
ns
ADDR/CMD
DLL Phase Alignment
tDDKHOV
tDDSHMH
tDDKLDS
tDDKHDS
MDQ[x]
MDQS[n]
MSYNC_IN
MSYNC_OUT
MCK[n]
tMCK
tDDSHME
tDDKLDX
tDDKHDX
tDDSHMP
D1
D0
tDDKHOX
Write A0
NOOP
tMCK
tMCKH
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