參數(shù)資料
型號(hào): MPC8540PXAPDB
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 833 MHz, MICROPROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù): 95/104頁
文件大小: 2133K
代理商: MPC8540PXAPDB
MPC8540 Integrated Processor Hardware Specifications, Rev. 3.1
90
Freescale Semiconductor
Thermal
Figure 51. Exploded Views (2) of a Heat Sink Attachment using a Plastic Force
The die junction-to-ambient and the heat sink-to-ambient thermal resistances are common figure-of-merits used for
comparing the thermal performance of various microelectronic packaging technologies, one should exercise caution
when only using this metric in determining thermal management because no single parameter can adequately
describe three-dimensional heat flow. The final die-junction operating temperature is not only a function of the
component-level thermal resistance, but the system level design and its operating conditions. In addition to the
component’s power consumption, a number of factors affect the final operating die-junction temperature: airflow,
board population (local heat flux of adjacent components), system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today’s microelectronic
equipment, the combined effects of the heat transfer mechanisms (radiation convection and conduction) may vary
widely. For these reasons, we recommend using conjugate heat transfer models for the boards, as well as,
system-level designs.
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