參數(shù)資料
型號: MPC8536EBVTAVLA
廠商: Freescale Semiconductor
文件頁數(shù): 64/126頁
文件大?。?/td> 0K
描述: MPU PWRQUICC III 1500MHZ 783PBGA
產(chǎn)品培訓(xùn)模塊: MPC8536E QUICC III Processor
標(biāo)準(zhǔn)包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.5GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
其它名稱: MPC8536EBVTAVL
MPC8536EBVTAVL-ND
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Electrical Characteristics
Freescale Semiconductor
42
2.9.2
FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing Specifications
The AC timing specifications for FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI are presented in this section.
2.9.2.1
FIFO AC Specifications
The basis for the AC specifications for the eTSEC’s FIFO modes is the double data rate RGMII and RTBI specifications, since
they have similar performance and are described in a source-synchronous fashion like FIFO modes. However, the FIFO
interface provides deliberate skew between the transmitted data and source clock in GMII fashion.
When the eTSEC is configured for FIFO modes, all clocks are supplied from external sources to the relevant eTSEC interface.
That is, the transmit clock must be applied to the eTSECn’s TSECn_TX_CLK, while the receive clock must be applied to pin
TSECn_RX_CLK. The eTSEC internally uses the transmit clock to synchronously generate transmit data and outputs an echoed
copy of the transmit clock back out onto the TSECn_GTX_CLK pin (while transmit data appears on TSECn_TXD[7:0], for
example). It is intended that external receivers capture eTSEC transmit data using the clock on TSECn_GTX_CLK as a source-
synchronous timing reference. Typically, the clock edge that launched the data can be used, since the clock is delayed by the
eTSEC to allow acceptable set-up margin at the receiver. Note that there is relationship between the maximum FIFO speed and
the platform speed. For more information see Section 2.4.6, “Platform to FIFO Restrictions.”
A summary of the FIFO AC specifications appears in the following tables.
Table 25. RGMII, RTBI, and FIFO DC Electrical Characteristics
Parameters
Symbol
Min
Max
Unit
Notes
Supply voltage 2.5 V
LVDD/TVDD
2.37
2.63
V
1,2
1 LV
DD supports eTSECs 1.
2 TV
DD supports eTSECs 3.
Output high voltage
(LVDD/TVDD = Min, IOH = –1.0 mA)
VOH
2.00
LVDD/TVDD + 0.3
V
Output low voltage
(LVDD/TVDD = Min, IOL = 1.0 mA)
VOL
GND – 0.3
0.40
V
Input high voltage
VIH
1.70
LVDD/TVDD + 0.3
V
Input low voltage
VIL
–0.3
0.70
V
Input high current
(VIN = LVDD, VIN = TVDD)
IIH
—10
μA
1, 2,3
3 Note that the symbol V
IN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2.
Input low current
(VIN = GND)
IIL
–15
μA
3
Note:
Table 26. FIFO Mode Transmit AC Timing Specification
Parameter/Condition
Symbol
Min
Typ
Max
Unit
TX_CLK, GTX_CLK clock period2
tFIT
6.0
8.0
100
ns
TX_CLK, GTX_CLK duty cycle
tFITH
45
50
55
%
TX_CLK, GTX_CLK peak-to-peak jitter
tFITJ
250
ps
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