- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45366 > MPC852TVR100 (MOTOROLA INC) 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256 PDF資料下載
參數(shù)資料
| 型號(hào)： | MPC852TVR100 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256 |
| 封裝： | PLASTIC, BGA-256 |
| 文件頁(yè)數(shù)： | 56/72頁(yè) |
| 文件大?。?/td> | 1210K |
| 代理商： | MPC852TVR100 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)當(dāng)前第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)
6
MPC852T Hardware Specifications
MOTOROLA
Thermal Characteristics
4
Thermal Characteristics
Table 3 shows the thermal characteristics for the MPC852T.
Table 3. MPC852T Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction to ambient 1
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
Natural convection
Single layer board (1s)
RθJA
2
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal
49
°C/W
Four layer board (2s2p)
RθJMA
3
3 Per JEDEC JESD51-6 with the board horizontal
32
Air flow (200 ft/min)
Single layer board (1s)
RθJMA
41
Four layer board (2s2p)
RθJMA
29
Junction to board 4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
RθJB
24
Junction to case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature. For exposed pad packages where the pad would be expected to be soldered, junction to
case thermal resistance is a simulated value from the junction to the exposed pad without contact
resistance.
RθJC
13
Junction to package top 6
6 Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2
Natural convection
ΨJT
3
Air flow (200 ft/min)
ΨJT
2
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8533EVTALJB | 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783 |
| MPC8533VTARFB | 32-BIT, 1067 MHz, RISC PROCESSOR, PBGA783 |
| MPC8533VTANGB | 32-BIT, 800 MHz, RISC PROCESSOR, PBGA783 |
| MPC8533VTAQGB | 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783 |
| MPC8533EVTARJB | 32-BIT, 1067 MHz, RISC PROCESSOR, PBGA783 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC852TVR100A | 功能描述:微處理器 - MPU Ethernet 100 MHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC852TVR100A | 制造商:Freescale Semiconductor 功能描述:IC COMMUNICATIONS CONTROLLER CMOS BGA |
| MPC852TVR50 | 制造商:Freescale Semiconductor 功能描述: |
| MPC852TVR50A | 功能描述:微處理器 - MPU Ethernet 50 MHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC852TVR66 | 功能描述:IC MPU POWERQUICC 66MHZ 256-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。