參數(shù)資料
型號: MPC8379E-RDBA
廠商: Freescale Semiconductor
文件頁數(shù): 36/117頁
文件大小: 0K
描述: BOARD REF DESIGN MPC8379E
標(biāo)準(zhǔn)包裝: 1
系列: PowerQUICC II™ PRO
類型: MPU
適用于相關(guān)產(chǎn)品: MPC8379E
所含物品:
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
25
This figure shows the MII transmit AC timing diagram.
Figure 7. MII Transmit AC Timing Diagram
8.2.1.2
MII Receive AC Timing Specifications
This table provides the MII receive AC timing specifications.
TX_CLK data clock rise (20%–80%)
tMTXR
1.0
4.0
ns
TX_CLK data clock fall (80%–20%)
tMTXF
1.0
4.0
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII
transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in
general, the clock reference symbol representation is based on two to three letters representing the clock of a particular
functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
Table 27. MII Receive AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%.
Parameter
Symbol1
Min
Typical
Max
Unit
Input low voltage
VIL
——
0.7
V
Input high voltage
VIH
1.9
V
RX_CLK clock period 10 Mbps
tMRX
400
ns
RX_CLK clock period 100 Mbps
tMRX
—40
ns
RX_CLK duty cycle
tMRXH/tMRX
35
65
%
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
tMRDVKH
10.0
ns
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
tMRDXKH
10.0
ns
Table 26. MII Transmit AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 3.3 V ± 5%.
Parameter
Symbol1
Min
Typical
Max
Unit
TX_CLK
TXD[3:0]
tMTKHDX
tMTX
tMTXH
tMTXR
tMTXF
TX_EN
TX_ER
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