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參數(shù)資料
| 型號： | MPC8377ECVRANGA |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, MICROPROCESSOR, PBGA689 |
| 封裝： | 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-689 |
| 文件頁數(shù)： | 16/124頁 |
| 文件大?。?/td> | 1462K |
| 代理商： | MPC8377ECVRANGA |
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MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
112
Freescale Semiconductor
Thermal
24.2
Thermal Management Information
For the following sections, PD = (VDD × IDD) + PI/O where PI/O is the power dissipation of the I/O drivers.
24.2.1
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TJ = junction temperature (°C)
TA = ambient temperature for the package (°C)
RθJA = junction to ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction to ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Generally, the value obtained on a single layer board is appropriate for
a tightly packed printed circuit board. The value obtained on the board with the internal planes is usually
appropriate if the board has low power dissipation and the components are well separated. Test cases have
demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible.
24.2.2
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
NOTE
The heat sink cannot be mounted on the package.
Junction-to-package natural convection on top
ψJT
6
°C/W
Note:
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3 Per JEDEC JESD51-6 with the board horizontal.
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 80. Package Thermal Characteristics for TePBGA II (continued)
Parameter
Symbol
Value
Unit
Notes
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| MPC8377ECZQAFDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377ECZQAFFA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377ECZQAFGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377ECZQAGDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377ECZQAGFA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
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