參數(shù)資料
型號： MPC8349CZUAJFB
廠商： Freescale Semiconductor
文件頁數(shù)： 72/87頁
文件大?。?/td> 0K
描述： IC MPU POWERQUICC II PRO 672TBGA
標準包裝： 24
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 533MHz
電壓： 1.2V
安裝類型： 表面貼裝
封裝/外殼： 672-LBGA
供應(yīng)商設(shè)備封裝： 672-TBGA（35x35）
包裝： 托盤
配用： MPC8349E-MITX-GP-ND - KIT REFERENCE PLATFORM MPC8349E
MPC8349E-MITXE-ND - BOARD REFERENCE FOR MPC8349
MPC8349EA-MDS-PB-ND - KIT MODULAR DEV SYSTEM MPC8349E
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
74
Freescale Semiconductor
Thermal
20 Thermal
This section describes the thermal specifications of the MPC8349EA.
20.1
Thermal Characteristics
Table 63 provides the package thermal characteristics for the 672 35
× 35 mm TBGA of the MPC8349EA.
306
0011
0000110
—
66
200
600
405
0100
0000101
—
66
266
667
504
0101
0000100
—
66
333
667
1 The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and
COREPLL settings given in the table.
2 The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode.
Table 63. Package Thermal Characteristics for TBGA
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection on single-layer board (1s)
RθJA
14
°C/W
1, 2
Junction-to-ambient natural convection on four-layer board (2s2p)
RθJMA
11
°C/W
1, 3
Junction-to-ambient (at 200 ft/min) on single-layer board (1s)
RθJMA
11
°C/W
1, 3
Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)
RθJMA
8
°C/W
1, 3
Junction-to-ambient (at 2 m/s) on single-layer board (1s)
RθJMA
9
°C/W
1, 3
Junction-to-ambient (at 2 m/s) on four-layer board (2s2p)
RθJMA
7
°C/W
1, 3
Junction-to-board thermal
RθJB
3.8
°C/W
4
Junction-to-case thermal
RθJC
1.7
°C/W
5
Table 62. Suggested PLL Configurations (continued)
Ref
No.1
RCWL
400 MHz Device
533 MHz Device
667 MHz Device
SPMF
CORE
PLL
Input
Clock
Freq
(MHz)2
CSB
Freq
(MHz)
Core
Freq
(MHz)
Input
Clock
Freq
(MHz)2
CSB
Freq
(MHz)
Core
Freq
(MHz)
Input
Clock
Freq
(MHz)2
CSB
Freq
(MHz)
Core
Freq
(MHz)
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