參數(shù)資料
型號(hào)： MPC8323E-RDB
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 69/82頁(yè)
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描述： BOARD REFERENCE DESIGN
產(chǎn)品培訓(xùn)模塊： MPC8323E PowerQUICC II Pro Processor
標(biāo)準(zhǔn)包裝： 1
系列： PowerQUICC II™ PRO
類型： MCU
適用于相關(guān)產(chǎn)品： MPC8323E
所含物品： 參考設(shè)計(jì)板、軟件和說(shuō)明文檔
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更多...
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Freescale Semiconductor
71
Thermal
22.7
Suggested PLL Configurations
To simplify the PLL configurations, the MPC8323E might be separated into two clock domains. The first
domain contain the CSB PLL and the core PLL. The core PLL is connected serially to the CSB PLL, and
has the csb_clk as its input clock. The second clock domain has the QUICC Engine PLL. The clock
domains are independent, and each of their PLLs are configured separately. Both of the domains has one
common input clock. Table 63 shows suggested PLL configurations for 33, 25, and 66 MHz input clocks.
23 Thermal
This section describes the thermal specifications of the MPC8323E.
23.1
Thermal Characteristics
Table 64 provides the package thermal characteristics for the 516 27
× 27 mm PBGA of the MPC8323E.
Table 63. Suggested PLL Configurations
Conf No.
SPMF
Core
PLL
CEMF
CEDF
Input Clock
Frequency
(MHz)
CSB
Frequency
(MHz)
Core
Frequency
(MHz)
QUICC
Engine
Frequency
(MHz)
1
0100
0000100
0110
0
33.33
133.33
266.66
200
2
0100
0000101
1000
0
25
100
250
200
3
0010
0000100
0011
0
66.67
133.33
266.66
200
4
0100
0000101
0110
0
33.33
133.33
333.33
200
5
0101
0000101
1000
0
25
125
312.5
200
6
0010
0000101
0011
0
66.67
133.33
333.33
200
Table 64. Package Thermal Characteristics for PBGA
Characteristic
Board type
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
Single-layer board (1s)
RθJA
28
°C/W
1, 2
Junction-to-ambient natural convection
Four-layer board (2s2p)
RθJA
21
°C/W
1, 2, 3
Junction-to-ambient (@200 ft/min)
Single-layer board (1s)
RθJMA
23
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
Four-layer board (2s2p)
RθJMA
18
°C/W
1, 3
Junction-to-board
—
RθJB
13
°C/W
4
Junction-to-case
—
RθJC
9°C/W
5
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8323E-RDB 制造商:Freescale Semiconductor 功能描述:MPC8323E Integrated Multiservice Gateway
MPC8323EVRADDC 功能描述:微處理器 - MPU 8323 NOPB PBGA W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8323EVRADDCA 制造商:Freescale Semiconductor 功能描述:POWERQUICC, 32 BIT POWER ARCHITECTURE SOC, 266MHZ E300, QE, - Trays 制造商:Freescale Semiconductor 功能描述:IC MPU PWRQUICC 266MHZ 516BGA
MPC8323EVRAFDC 功能描述:微處理器 - MPU 8323 NOPB PBGA W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8323EVRAFDCA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications
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