參數(shù)資料
型號(hào)： MPC8264CZU
廠商： Motorola, Inc.
英文描述： MPC826xA (HiP4) Family Hardware Specifications
中文描述： MPC826xA（HiP4）家庭硬件規(guī)格
文件頁數(shù)： 44/48頁
文件大?。?/td> 315K
代理商： MPC8264CZU
44
MPC826xA (HiP4) Family Hardware Specifications
MOTOROLA
Package Description
1.5.2
Mechanical Dimensions
Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package.
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature
Dim
Millimeters
Min
Max
A
1.45
1.65
A1
0.60
0.70
A2
0.85
0.95
A3
0.25
—
b
0.65
0.85
D
37.50 BSC
D1
35.56 REF
e
1.27 BSC
E
37.50 BSC
E1
35.56 REF
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter,
parallel to primary data A.
4. Primary data A and the seating
plane are defined by the spherical
crowns of the solder balls.
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