參數(shù)資料
型號(hào)： MPC8260CZUFFBB3
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 133 MHz, RISC PROCESSOR, PBGA480
封裝： 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480
文件頁數(shù)： 22/48頁
文件大?。?/td> 688K
代理商： MPC8260CZUFFBB3
MOTOROLA
MPC826xA (HiP4) Family Hardware Specications
29
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Pinout
Figure 12. Pinout of the 480 TBGA Package as Viewed from the Top Surface
Figure 13 shows the side prole of the TBGA package to indicate the direction of the top surface view.
Figure 13. Side View of the TBGA Package
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Soldermask
Copper Traces
Die
Copper Heat Spreader
(Oxidized for Insulation)
1.27 mm Pitch
Glob-Top Dam
Etched
Pressure Sensitive
Die
Glob-Top Filled Area
Polymide Tape
Cavity
Adhesive
Attach
View
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