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參數(shù)資料
| 型號(hào)： | MPC8260ACZU |
| 廠商： | Motorola, Inc. |
| 英文描述： | MPC826xA (HiP4) Family Hardware Specifications |
| 中文描述： | MPC826xA（HiP4）家庭硬件規(guī)格 |
| 文件頁數(shù)： | 6/48頁 |
| 文件大?。?/td> | 315K |
| 代理商： | MPC8260ACZU |
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6
MPC826xA (HiP4) Family Hardware Specifications
MOTOROLA
Electrical and Thermal Characteristics
– Internal rate mode (sub-rate)—FCC transfers only the data cells using the required data rate.
The TC layer generates idle/unassigned cells to maintain the line bit rate.
— Supports TC-layer and PMD-WIRE interface (according to the ATM-Forum af-phy-0063.000)
— Cell counters for performance monitoring
– 16-bit counters count
– HEC error cells
– HEC single bit error and corrected cells
– Idle/unassigned cells filtered
– Idle/unassigned cells transmitted
– Transmitted ATM cells
– Received ATM cells
– Maskable interrupt is sent to the host when a counter expires
— Overrun (Rx cell FIFO) and underrun (Tx cell FIFO) condition produces maskable interrupt
— May be operated at E1 and DS-1 rates. In addition, xDSL applications at bit rates up to 10 Mbps
are supported
PCI bridge (MPC8265 and MPC8266 only)
— PCI Specification Revision 2.2 compliant and supports frequencies up to 66 MHz
— On-chip arbitration
— Support for PCI to 60x memory and 60x memory to PCI streaming
— PCI Host Bridge or Periphera
l
capabilities
— Includes 4 DMA channels for the following transfers:
– PCI-to-60x to 60x-to-PCI
– 60x-to-PCI to PCI-to-60x
– PCI-to-60x to PCI-to-60x
– 60x-to-PCI to 60x-to-PCI
— Includes all of the configuration registers (which are automatically loaded from the EPROM
and used to configure the MPC8265) required by the PCI standard as well as message and
doorbell registers
— Supports the I
2
O standard
— Hot-Swap friendly (supports the Hot Swap Specification as defined by PICMG 2.1 R1.0
August 3, 1998)
— Support for 66 MHz, 3.3 V specification
— 60x-PCI bus core logic which uses a buffer pool to allocate buffers for each port
— Makes use of the local bus signals, so there is no need for additional pins
1.2
Electrical and Thermal Characteristics
This section provides AC and DC electrical specifications and thermal characteristics for the MPC826xA.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8260ACZUMHBB | 功能描述:微處理器 - MPU POWERQUICC II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8260ACZUMIBB | 功能描述:微處理器 - MPU POWERQUICC II HIP4 REV B RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8260ADS-FLASH | 功能描述:開發(fā)板和工具包 - 其他處理器 FLASH CHIP FOR 8260ADS RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MPC8260ADS-TCOM | 功能描述:子卡和OEM板 PQII ADS BRD RoHS:否 制造商:BeagleBoard by CircuitCo 產(chǎn)品:BeagleBone LCD4 Boards 用于:BeagleBone - BB-Bone - Open Source Development Kit |
| MPC8260AEC | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
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